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IRFS3006TRL7PP PDF预览

IRFS3006TRL7PP

更新时间: 2024-11-24 14:51:35
品牌 Logo 应用领域
英飞凌 - INFINEON 开关脉冲晶体管
页数 文件大小 规格书
9页 310K
描述
Power Field-Effect Transistor, 240A I(D), 60V, 0.0021ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263, LEAD FREE, TO-263CB, D2PAK-7

IRFS3006TRL7PP 技术参数

是否无铅: 不含铅是否Rohs认证: 不符合
生命周期:Active包装说明:LEAD FREE, TO-263CB, D2PAK-7
Reach Compliance Code:compliantECCN代码:EAR99
Factory Lead Time:15 weeks风险等级:1.85
雪崩能效等级(Eas):303 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (ID):240 A最大漏源导通电阻:0.0021 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-263
JESD-30 代码:R-PSSO-G6湿度敏感等级:1
元件数量:1端子数量:6
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):1172 A表面贴装:YES
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRFS3006TRL7PP 数据手册

 浏览型号IRFS3006TRL7PP的Datasheet PDF文件第2页浏览型号IRFS3006TRL7PP的Datasheet PDF文件第3页浏览型号IRFS3006TRL7PP的Datasheet PDF文件第4页浏览型号IRFS3006TRL7PP的Datasheet PDF文件第5页浏览型号IRFS3006TRL7PP的Datasheet PDF文件第6页浏览型号IRFS3006TRL7PP的Datasheet PDF文件第7页 
PD - 96187  
IRFS3006-7PPbF  
HEXFET® Power MOSFET  
Applications  
l High Efficiency Synchronous Rectification in SMPS  
l Uninterruptible Power Supply  
l High Speed Power Switching  
D
VDSS  
RDS(on) typ.  
max.  
ID (Silicon Limited)  
ID (Package Limited)  
60V  
1.5m  
2.1m  
293A  
240A  
G
l Hard Switched and High Frequency Circuits  
S
Benefits  
l Improved Gate, Avalanche and Dynamic dV/dt  
D
Ruggedness  
l Fully Characterized Capacitance and Avalanche  
SOA  
l Enhanced body diode dV/dt and dI/dt Capability  
l Lead-Free  
S
S
S
S
S
G
D2Pak 7 Pin  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Symbol  
Parameter  
Max.  
293  
Units  
ID @ TC = 25°C  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
ID @ TC = 100°C  
ID @ TC = 25°C  
IDM  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
207  
A
Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current  
240  
1172  
375  
PD @TC = 25°C  
W
Maximum Power Dissipation  
Linear Derating Factor  
2.5  
W/°C  
V
VGS  
± 20  
Gate-to-Source Voltage  
11  
Peak Diode Recovery  
dv/dt  
TJ  
V/ns  
-55 to + 175  
Operating Junction and  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
(1.6mm from case)  
°C  
300  
10lb in (1.1N m)  
Mounting torque, 6-32 or M3 screw  
Avalanche Characteristics  
Single Pulse Avalanche Energy  
EAS (Thermally limited)  
303  
mJ  
A
Avalanche Current  
IAR  
See Fig. 14, 15, 22a, 22b,  
Repetitive Avalanche Energy  
EAR  
mJ  
Thermal Resistance  
Symbol  
Parameter  
Typ.  
–––  
Max.  
0.4  
Units  
RθJC  
Junction-to-Case  
°C/W  
RθJA  
–––  
40  
Junction-to-Ambient (PCB Mount)  
www.irf.com  
1
10/06/08  

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