Datasheet > IRFR/U3504

IRFR/U3504

更新时间： 2024-09-17 12:33:43

品牌	Logo	应用领域
科盛美 - KERSEMI		/
页数	文件大小	规格书
11页	4569K
描述
AUTOMOTIVE MOSFET

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IRFR/U3504 数据手册

PD - 94499A

IRFR3504

IRFU3504

AUTOMOTIVE MOSFET

HEXFET^®Power MOSFET

Features

●

Advanced Process Technology

UltraLowOn-Resistance

175°COperatingTemperature

Fast Switching

V_DSS= 40V

Repetitive Avalanche Allowed up to Tjmax

R_DS(on)= 9.2mΩ

Description

SpecificallydesignedforAutomotiveapplications,thisHEXFET®

Power MOSFET utilizes the latest processing techniques to

achieve extremely low on-resistance per silicon area. Addi-

tional features of this product are a 175°C junction operating

temperature, fast switching speed and improved repetitive

avalanche rating. These features combine to make this design

an extremely efficient and reliable device for use in Automotive

applications and a wide variety of other applications.

I_D= 30A

The D-Pak is designed for surface mounting using vapor

phase, infrared, or wave soldering techniques. The straight

lead version (IRFU series) is for through-hole mounting

applications. Power dissipation levels up to 1.5 watts are

possible in typical surface mount applications.

D-Pak

IRFR3504

I-Pak

IRFU3504

Absolute Maximum Ratings

Parameter

Max.

Units

I_D@ T_C= 25°C

I_D@ T_C= 100°C

I_D@ T_C= 25°C

I_DM

Continuous Drain Current, V_GS@ 10V (Silicon limited)

Continuous Drain Current, V_GS@ 10V (See Fig.9)

Continuous Drain Current, V_GS@ 10V (Package limited)

Pulsed Drain Current

350

P_D@T_C= 25°C

Power Dissipation

140

W/°C

Linear Derating Factor

0.92

V_GS

Gate-to-Source Voltage

E_AS

Single Pulse Avalanche Energy

Single Pulse Avalanche Energy Tested Value

Avalanche Current

240

480

E_AS(tested)

I_AR

See Fig.12a, 12b, 15, 16

E_AR

Repetitive Avalanche Energy

Operating Junction and

T_J

-55 to + 175

T_STG

Storage Temperature Range

°C

Soldering Temperature, for 10 seconds

300 (1.6mm from case )

Thermal Resistance

Parameter

Junction-to-Case

Typ.

–––

Max.

1.09

Units

R_θJC

R_θJA

Junction-to-Ambient (PCB mount)

°C/W

Junction-to-Ambient

110

www.kersemi.com

12/11/02

12 3 4 5 6 7...11

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