IRFR010, SiHFR010
Vishay Siliconix
Power MOSFET
FEATURES
• Low Drive Current
• Surface Mount
• Fast Switching
• Ease of Paralleling
PRODUCT SUMMARY
VDS (V)
50
R
DS(on) ()
VGS = 10 V
0.20
Qg (Max.) (nC)
10
2.6
• Excellent Temperature Stability
• Compliant to RoHS Directive 2002/95/EC
Q
Q
gs (nC)
gd (nC)
4.8
DESCRIPTION
Configuration
Single
The Power MOSFET technology is the key to Vishay’s
advanced line of Power MOSFET transistors. The efficient
geometry and unique processing of this latest “State of the
Art” design achieves: very low on-state resistance
combined with high transconductance; superior reverse
energy and diode recovery dV/dt capability.
D
DPAK
(TO-252)
The Power MOSFET transistors also feature all of the well
established advantages of MOSFET’S such as voltage
control, very fast switching, ease of paralleling and
temperature stability of the electrical parameters.
Surface mount packages enhance circuit performance by
reducing stray inductances and capacitance. The DPAK
(TO-252) surface mount package brings the advantages of
Power MOSFET’s to high volume applications where PC
Board surface mounting is desirable. The surface mount
option IRFR9012, SiHFR9012 is provided on 16 mm tape.
The straight lead option IRFU9012, SiHFU9012 of the device
is called the IPAK (TO-251).
G
D
S
G
S
N-Channel MOSFET
They are well suited for applications where limited heat
dissipation is required such as, computers and peripherals,
telecommunication equipment, dc-to-dc converters, and a
wide range of consumer products.
ORDERING INFORMATION
Package
DPAK (TO-252)
IRFR010PbF
SiHFR010-E3
IRFR010
Lead (Pb)-free
SnPb
SiHFR010
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
50
V
VGS
20
T
C = 25 °C
8.2
Continuous Drain Current
VGS at 10 V
ID
TC = 100 °C
5.2
A
Pulsed Drain Currenta
Avalanche Currentb
IDM
IAS
33
1.5
Linear Derating Factor
0.20
W/°C
W
Maximum Power Dissipation
TC = 25 °C
PD
25
Peak Diode Recovery dV/dtc
dV/dt
TJ, Tstg
2.0
V/ns
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
- 55 to + 150
300d
°C
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 25 V, starting TJ = 25 °C, L = 100 μH, Rg = 25 .
c. ISD 8.2 A, dI/dt 130 A/μs, VDD 40 V, TJ 150 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91420
S10-1510-Rev. A, 19-Jul-10
www.vishay.com
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