IRFR014, IRFU014, SiHFR014, SiHFU014
www.vishay.com
Vishay Siliconix
Power MOSFET
FEATURES
D
• Dynamic dV/dt rating
• Surface-mount (IRFR014, SiHFR014)
• Straight lead (IRFU014, SiHFU014)
• Available in tape and reel
DPAK
(TO-252)
IPAK
(TO-251)
D
G
D
Available
• Fast switching
• Ease of paralleling
S
G
S
D
• Simple drive requirements
G
S
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
N-Channel MOSFET
DESCRIPTION
PRODUCT SUMMARY
Third generation power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU, SiHFU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surface mount applications.
VDS (V)
60
RDS(on) (Ω)
VGS = 10 V
0.20
Qg max. (nC)
11
3.1
Q
gs (nC)
gd (nC)
Q
5.8
Configuration
Single
ORDERING INFORMATION
PACKAGE
DPAK (TO-252)
DPAK (TO-252)
SiHFR014TRL-GE3
IRFR014TRLPbF a
-
DPAK (TO-252)
SiHFR014TR-GE3
IRFR014TRPbF a
-
IPAK (TO-251)
Lead (Pb)-free and Halogen-free SiHFR014-GE3
SIHFU014-GE3
IRFR014PbF
Lead (Pb)-free
IRFU014PbF
IRFR014TRRPbF
-
-
Lead (Pb)-free and Halogen-free IRFR014PbF-BE3 ab
IRFR014TRLPbF-BE3 ab IRFR014TRPbF-BE3 ab
Notes
a. See device orientation
b. “-BE3” denotes alternate manufacturing location
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
60
UNIT
Drain-source voltage
Gate-source voltage
VDS
V
VGS
20
T
C = 25 °C
7.7
Continuous drain current
VGS at 10 V
ID
TC = 100 °C
4.9
A
Pulsed drain current a
IDM
31
Linear derating factor
0.20
0.020
27.4
25
W/°C
mJ
Linear derating factor (PCB mount) e
Single pulse avalanche energy b
Maximum power dissipation
Maximum power dissipation (PCB mount) e
Peak diode recovery dV/dt c
EAS
PD
T
C = 25 °C
W
TA = 25 °C
2.5
dV/dt
4.5
V/ns
°C
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d
TJ, Tstg
-55 to +150
260
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
b. VDD = 25 V, starting TJ = 25 °C, L = 924 μH, Rg = 25 Ω, IAS = 7.7 A (see fig. 12)
c. ISD ≤ 10 A, dI/dt ≤ 90 A/μs, VDD ≤ VDS, TJ ≤ 150 °C
d. 1.6 mm from case
e. When mounted on 1" square PCB (FR-4 or G-10 material)
S21-0466-Rev. F, 17-May-2021
Document Number: 91263
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000