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IRFR014TRLPBF PDF预览

IRFR014TRLPBF

更新时间: 2024-11-28 05:39:31
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
8页 1768K
描述
Power MOSFET

IRFR014TRLPBF 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:TO-252AA
包装说明:SMALL OUTLINE, R-PSSO-G2针数:3
Reach Compliance Code:unknownECCN代码:EAR99
Factory Lead Time:6 weeks风险等级:0.66
雪崩能效等级(Eas):47 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (Abs) (ID):7.7 A最大漏极电流 (ID):7.7 A
最大漏源导通电阻:0.2 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-252AAJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):25 W
最大脉冲漏极电流 (IDM):31 A认证状态:Not Qualified
子类别:FET General Purpose Powers表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRFR014TRLPBF 数据手册

 浏览型号IRFR014TRLPBF的Datasheet PDF文件第2页浏览型号IRFR014TRLPBF的Datasheet PDF文件第3页浏览型号IRFR014TRLPBF的Datasheet PDF文件第4页浏览型号IRFR014TRLPBF的Datasheet PDF文件第5页浏览型号IRFR014TRLPBF的Datasheet PDF文件第6页浏览型号IRFR014TRLPBF的Datasheet PDF文件第7页 
IRFR014, IRFU014, SiHFR014, SiHFU014  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Dynamic dV/dt Rating  
PRODUCT SUMMARY  
VDS (V)  
60  
Available  
• Surface Mount (IRFR014/SiHFR014)  
• Straight Lead (IRFU014/SiHFU014)  
• Available in Tape and Reel  
• Fast Switching  
R
DS(on) (Ω)  
VGS = 10 V  
0.20  
RoHS*  
Qg (Max.) (nC)  
11  
3.1  
COMPLIANT  
Q
Q
gs (nC)  
gd (nC)  
5.8  
Configuration  
Single  
• Ease of Paralleling  
D
• Simple Drive Requirements  
• Lead (Pb)-free Available  
DPAK  
IPAK  
(TO-252)  
(TO-251)  
G
DESCRIPTION  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
S
N-Channel MOSFET  
The DPAK is designed for surface mounting using vapor  
phase, infrared, or wave soldering techniques. The straight  
lead version (IRFU/SiHFU series) is for through-hole  
mounting applications. Power dissipation levels up to 1.5 W  
are possible in typical surface mount applications.  
ORDERING INFORMATION  
Package  
DPAK (TO-252)  
DPAK (TO-252)  
DPAK (TO-252)  
IRFR014TRPbFa  
SiHFR014T-E3a  
IRFR014TRa  
IPAK (TO-251)  
IRFU014PbF  
SiHFU014-E3  
IRFU014  
IRFR014PbF  
SiHFR014-E3  
IRFR014  
IRFR014TRLPbFa  
SiHFR014TL-E3a  
IRFR014TRLa  
Lead (Pb)-free  
SnPb  
SiHFR014  
SiHFR014TLa  
SiHFR014Ta  
SiHFU014  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
60  
20  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
TC = 25 °C  
TC =100°C  
7.7  
4.9  
Continuous Drain Current  
VGS at 10 V  
ID  
A
Pulsed Drain Currenta  
IDM  
31  
Linear Derating Factor  
0.20  
0.020  
47  
W/°C  
mJ  
Linear Derating Factor (PCB Mount)e  
Single Pulse Avalanche Energyb  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB Mount)e  
Peak Diode Recovery dV/dtc  
EAS  
PD  
T
C = 25 °C  
25  
W
TA = 25 °C  
2.5  
dV/dt  
4.5  
V/ns  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91263  
S-81432-Rev. A, 07-Jul-08  
www.vishay.com  
1

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