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IRFR024N PDF预览

IRFR024N

更新时间: 2024-11-27 22:51:39
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
10页 180K
描述
Power MOSFET(Vdss=55V, Rds(on)=0.075ohm, Id=17A)

IRFR024N 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:DPAK-3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.1
其他特性:AVALANCHE RATED雪崩能效等级(Eas):71 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:55 V最大漏极电流 (ID):17 A
最大漏源导通电阻:0.075 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-252AAJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):68 A认证状态:Not Qualified
表面贴装:YES端子面层:MATTE TIN OVER NICKEL
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:30晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRFR024N 数据手册

 浏览型号IRFR024N的Datasheet PDF文件第2页浏览型号IRFR024N的Datasheet PDF文件第3页浏览型号IRFR024N的Datasheet PDF文件第4页浏览型号IRFR024N的Datasheet PDF文件第5页浏览型号IRFR024N的Datasheet PDF文件第6页浏览型号IRFR024N的Datasheet PDF文件第7页 
PD- 9.1336A  
IRFR/U024N  
HEXFET® Power MOSFET  
PRELIMINARY  
l Ultra Low On-Resistance  
l Surface Mount (IRFR024N)  
l Straight Lead (IRFU024N)  
l Advanced Process Technology  
l Fast Switching  
D
VDSS = 55V  
RDS(on) = 0.075Ω  
G
l Fully Avalanche Rated  
ID = 17Aꢀ  
S
Description  
Fifth Generation HEXFETs from International Rectifier utilize advanced  
processing techniques to achieve the lowest possible on-resistance per  
silicon area. This benefit, combined with the fast switching speed and  
ruggedized device design that HEXFET Power MOSFETs are well known for,  
provides the designer with an extremely efficient device for use in a wide  
variety of applications.  
D -Pak  
TO -252AA  
I-Pak  
TO -251AA  
The D-PAK is designed for surface mounting using vapor phase, infrared, or  
wave soldering techniques. The straight lead version (IRFU series) is for  
through-hole mounting applications. Power dissipation levels up to 1.5 watts  
are possible in typical surface mount applications.  
Absolute Maximum Ratings  
Parameter  
Max.  
17  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current †  
12  
A
68  
PD @TC = 25°C  
Power Dissipation  
45  
W
W/°C  
V
Linear Derating Factor  
0.30  
± 20  
71  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy‚†  
Avalanche Current  
mJ  
A
10  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ†  
Operating Junction and  
4.5  
5.0  
mJ  
V/ns  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
°C  
300 (1.6mm from case )  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typ.  
–––  
–––  
Max.  
3.3  
50  
Units  
RθJC  
RθJA  
RθJA  
Case-to-Ambient (PCB mount)**  
Junction-to-Ambient  
°C/W  
–––  
110  
** When mounted on 1" square PCB (FR-4 or G-10 Material ) .  
For recommended footprint and soldering techniques refer to application note #AN-994  
www.irf.com  
1

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