PD - 94506A
IRFR3505
AUTOMOTIVE MOSFET
IRFU3505
HEXFET® Power MOSFET
Features
D
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Advanced Process Technology
VDSS = 55V
Ultra Low On-Resistance
175°C Operating Temperature
Fast Switching
RDS(on) = 0.013Ω
G
Repetitive Avalanche Allowed up to Tjmax
ID = 30A
S
Description
Specifically designed for Automotive applications, this HEXFET® Power
MOSFET utilizes the latest processing techniques to achieve extremely
low on-resistance per silicon area. Additional features of this product are
a 175°C junction operating temperature, fast switching speed and im-
proved repetitive avalanche rating. These features combine to make this
design an extremely efficient and reliable device for use in Automotive
applications and a wide variety of other applications.
D-Pak
IRFR3505
I-Pak
IRFU3505
The D-Pak is designed for surface mounting using vapor phase, infrared,
or wave soldering techniques. The straight lead version (IRFU series) is
for through-hole mounting applications. Power dissipation levels up to
1.5 watts are possible in typical surface mount applications.
Absolute Maximum Ratings
Parameter
Max.
Units
ID @ TC = 25°C
ID @ TC = 100°C
ID @ TC = 25°C
IDM
Continuous Drain Current, VGS @ 10V (Silicon limited)
Continuous Drain Current, VGS @ 10V (See Fig.9)
Continuous Drain Current, VGS @ 10V (Package limited)
Pulsed Drain Current
71
49
A
30
280
140
0.92
20
PD @TC = 25°C
Power Dissipation
W
W/°C
V
Linear Derating Factor
VGS
Gate-to-Source Voltage
EAS
Single Pulse Avalanche Energy
Single Pulse Avalanche Energy Tested Value
Avalanche Current
210
410
mJ
EAS (tested)
IAR
See Fig.12a, 12b, 15, 16
A
EAR
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
mJ
dv/dt
TJ
4.0
V/ns
Operating Junction and
-55 to + 175
TSTG
Storage Temperature Range
°C
Soldering Temperature, for 10 seconds
300 (1.6mm from case )
Thermal Resistance
Parameter
Junction-to-Case
Typ.
–––
–––
–––
Max.
1.09
40
Units
RθJC
RθJA
RθJA
Junction-to-Ambient (PCB mount)
°C/W
Junction-to-Ambient
110
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12/11/02