IRFR010, SiHFR010
www.vishay.com
Vishay Siliconix
Power MOSFET
FEATURES
D
• Low drive current
DPAK (TO-252)
• Surface-mount
• Fast switching
• Ease of paralleling
D
G
• Excellent temperature stability
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
S
G
S
DESCRIPTION
N-Channel MOSFET
The power MOSFET technology is the key to Vishay’s
advanced line of power MOSFET transistors. The efficient
geometry and unique processing of this latest “State of the
Art” design achieves: very low on-state resistance
combined with high transconductance; superior reverse
energy and diode recovery dV/dt capability.
PRODUCT SUMMARY
VDS (V)
50
RDS(on) (Ω)
VGS = 10 V
0.20
The power MOSFET transistors also feature all of the well
established advantages of MOSFET’S such as voltage
control, very fast switching, ease of paralleling and
temperature stability of the electrical parameters.
Surface mount packages enhance circuit performance by
reducing stray inductances and capacitance. The DPAK
(TO-252) surface-mount package brings the advantages of
power MOSFET’s to high volume applications where PC
Board surface mounting is desirable. The surface mount
option IRFR9012, SiHFR9012 is provided on 16 mm tape.
The straight lead option IRFU9012, SiHFU9012 of the device
is called the IPAK (TO-251).
Qg (Max.) (nC)
10
2.6
Q
gs (nC)
gd (nC)
Q
4.8
Configuration
Single
They are well suited for applications where limited heat
dissipation is required such as, computers and peripherals,
telecommunication equipment, dc-to-dc converters, and a
wide range of consumer products.
ORDERING INFORMATION
Package
DPAK (TO-252)
SiHFR010-GE3
IRFR010PbF
DPAK (TO-252)
SiHFR010TR-GE3
IRFR010TRPbF
DPAK (TO-252)
DPAK (TO-252)
IRFR010PbF-BE3
IRFR010TRRPbF
Lead (Pb)-free and halogen-free
Lead (Pb)-free
SiHFR010TRL-GE3
IRFR010TRLPbF
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-source voltage
Gate-source voltage
VDS
50
20
V
VGS
T
C = 25 °C
8.2
Continuous drain current
V
GS at 10 V
ID
TC = 100 °C
5.2
A
Pulsed drain current a
Avalanche current b
IDM
IAS
33
1.5
Linear derating factor
0.20
25
W/°C
W
Maximum power dissipation
Peak diode recovery dV/dt c
TC = 25 °C
For 10 s
PD
dV/dt
TJ, Tstg
2.0
V/ns
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d
-55 to +150
300
°C
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
b. VDD = 25 V, starting TJ = 25 °C, L = 100 μH, Rg = 25 Ω
c. ISD ≤ 8.2 A, dI/dt ≤ 130 A/μs, VDD ≤ 40 V, TJ ≤ 150 °C
d. 1.6 mm from case
e. When mounted on 1" square PCB (FR-4 or G-10 material)
S21-0466-Rev. C, 17-May-2021
Document Number: 91420
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000