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IRFR010, SiHFR010

更新时间: 2024-11-29 14:53:31
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威世 - VISHAY /
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11页 319K
描述
Power MOSFET

IRFR010, SiHFR010 数据手册

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IRFR010, SiHFR010  
www.vishay.com  
Vishay Siliconix  
Power MOSFET  
FEATURES  
D
• Low drive current  
DPAK (TO-252)  
• Surface-mount  
• Fast switching  
• Ease of paralleling  
D
G
• Excellent temperature stability  
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
S
G
S
DESCRIPTION  
N-Channel MOSFET  
The power MOSFET technology is the key to Vishay’s  
advanced line of power MOSFET transistors. The efficient  
geometry and unique processing of this latest “State of the  
Art” design achieves: very low on-state resistance  
combined with high transconductance; superior reverse  
energy and diode recovery dV/dt capability.  
PRODUCT SUMMARY  
VDS (V)  
50  
RDS(on) (Ω)  
VGS = 10 V  
0.20  
The power MOSFET transistors also feature all of the well  
established advantages of MOSFET’S such as voltage  
control, very fast switching, ease of paralleling and  
temperature stability of the electrical parameters.  
Surface mount packages enhance circuit performance by  
reducing stray inductances and capacitance. The DPAK  
(TO-252) surface-mount package brings the advantages of  
power MOSFET’s to high volume applications where PC  
Board surface mounting is desirable. The surface mount  
option IRFR9012, SiHFR9012 is provided on 16 mm tape.  
The straight lead option IRFU9012, SiHFU9012 of the device  
is called the IPAK (TO-251).  
Qg (Max.) (nC)  
10  
2.6  
Q
gs (nC)  
gd (nC)  
Q
4.8  
Configuration  
Single  
They are well suited for applications where limited heat  
dissipation is required such as, computers and peripherals,  
telecommunication equipment, dc-to-dc converters, and a  
wide range of consumer products.  
ORDERING INFORMATION  
Package  
DPAK (TO-252)  
SiHFR010-GE3  
IRFR010PbF  
DPAK (TO-252)  
SiHFR010TR-GE3  
IRFR010TRPbF  
DPAK (TO-252)  
DPAK (TO-252)  
IRFR010PbF-BE3  
IRFR010TRRPbF  
Lead (Pb)-free and halogen-free  
Lead (Pb)-free  
SiHFR010TRL-GE3  
IRFR010TRLPbF  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-source voltage  
Gate-source voltage  
VDS  
50  
20  
V
VGS  
T
C = 25 °C  
8.2  
Continuous drain current  
V
GS at 10 V  
ID  
TC = 100 °C  
5.2  
A
Pulsed drain current a  
Avalanche current b  
IDM  
IAS  
33  
1.5  
Linear derating factor  
0.20  
25  
W/°C  
W
Maximum power dissipation  
Peak diode recovery dV/dt c  
TC = 25 °C  
For 10 s  
PD  
dV/dt  
TJ, Tstg  
2.0  
V/ns  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) d  
-55 to +150  
300  
°C  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)  
b. VDD = 25 V, starting TJ = 25 °C, L = 100 μH, Rg = 25 Ω  
c. ISD 8.2 A, dI/dt 130 A/μs, VDD 40 V, TJ 150 °C  
d. 1.6 mm from case  
e. When mounted on 1" square PCB (FR-4 or G-10 material)  
S21-0466-Rev. C, 17-May-2021  
Document Number: 91420  
1
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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