IRFR/U5410
HEXFET® Power MOSFET
l Ultra Low On-Resistance
l P-Channel
l Surface Mount (IRFR5410)
l Straight Lead (IRFU5410)
l Advanced Process Technology
l Fast Switching
D
VDSS = -100V
RDS(on) = 0.205W
ID = -13A
G
l Fully Avalanche Rated
S
Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET Power MOSFETs are well
known for, provides the designer with an extremely efficient
and reliable device for use in a wide variety of applications.
D-Pak
I-Pak
TO-251AA
TO-252AA
The D-Pak is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU series) is for through-hole mounting
applications. Power dissipation levels up to 1.5 watts are
possible in typical surface mount applications.
Absolute Maximum Ratings
Parameter
Max.
Units
ID @ TC = 25°C
ID @ TC = 100°C
IDM
Continuous Drain Current, VGS @ -10V
Continuous Drain Current, VGS @ -10V
Pulsed Drain Current
-13
-8.2
-52
A
PD @TC = 25°C
Power Dissipation
66
W
W/°C
V
Linear Derating Factor
0.53
± 20
194
-8.4
6.3
VGS
EAS
IAR
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
mJ
A
EAR
dv/dt
TJ
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
mJ
-5.0
V/ns
-55 to + 150
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds
°C
300 (1.6mm from case )
Thermal Resistance
Parameter
Junction-to-Case
Typ.
Max.
1.9
Units
RqJC
RqJA
RqJA
Junction-to-Ambient (PCB mount)**
Junction-to-Ambient
50
°C/W
110
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