IRFN054
Power MOSFET Surface Mount (SMD-1)
Device Characteristics
2
Device Characteristics
2.1
Electrical Characteristics (Pre-Irradiation)
Table 3
Symbol
Static and Dynamic Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Parameter
Min. Typ. Max. Unit Test Conditions
Drain-to-Source Breakdown
Voltage
BVDSS
60
—
—
—
0.68
—
—
—
V
VGS = 0V, ID = 1.0mA
Breakdown Voltage Temp.
Coefficient
BVDSS/TJ
RDS(on)
V/°C Reference to 25°C, ID = 1.0mA
Static Drain-to-Source On-State
Resistance
0.020
VGS = 10V, ID2 = 40A 1
—
2.0
20
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0.031
4.0
—
VGS = 10V, ID2 = 55A 1
VGS(th)
Gfs
Gate Threshold Voltage
V
S
VDS = VGS, ID = 250A
VDS = 15V, ID2 = 40A 1
VDS = 48V, VGS = 0V
VDS = 48V,VGS = 0V,TJ = 125°C
VGS = 20V
Forward Transconductance
25
IDSS
IGSS
Zero Gate Voltage Drain Current
A
250
100
-100
160
48
Gate-to-Source Leakage Forward
Gate-to-Source Leakage Reverse
Total Gate Charge
nA
VGS = -20V
QG
ID1 = 55A
QGS
QGD
td(on)
tr
Gate-to-Source Charge
Gate-to-Drain (‘Miller’) Charge
Turn-On Delay Time
Rise Time
nC VDS = 30V
VGS = 10V
67
33
ID1 = 55A **
VDD = 30V
RG = 2.35
VGS = 10V
180
100
100
ns
td(off)
tf
Turn-Off Delay Time
Fall Time
Measured from the center of drain
pad to center of source pad.
Ls +LD
Total Inductance
—
4.0
—
nH
Ciss
Coss
Crss
Input Capacitance
—
—
—
4265
1746
493
—
—
—
VGS = 0V
pF VDS = 25V
Output Capacitance
ƒ = 1.0MHz
Reverse Transfer Capacitance
** Switching speed maximum limits are based on manufacturing test equipment and capability.
1 Pulse width 300 µs; Duty Cycle 2%
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2021-12-07