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IGC04R60D PDF预览

IGC04R60D

更新时间: 2024-11-24 21:19:39
品牌 Logo 应用领域
英飞凌 - INFINEON 功率控制晶体管
页数 文件大小 规格书
6页 138K
描述
Insulated Gate Bipolar Transistor, 600V V(BR)CES, N-Channel, 1.98 X 1.85 MM, DIE-2

IGC04R60D 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:DIE包装说明:UNCASED CHIP, R-XUUC-N2
针数:2Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.65
集电极-发射极最大电压:600 V配置:SINGLE WITH BUILT-IN DIODE
门极发射器阈值电压最大值:5.7 V门极-发射极最大电压:20 V
JESD-30 代码:R-XUUC-N2元件数量:1
端子数量:2最高工作温度:175 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:UNCASED CHIP峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL认证状态:Not Qualified
子类别:Insulated Gate BIP Transistors表面贴装:YES
端子形式:NO LEAD端子位置:UPPER
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:POWER CONTROL
晶体管元件材料:SILICONBase Number Matches:1

IGC04R60D 数据手册

 浏览型号IGC04R60D的Datasheet PDF文件第2页浏览型号IGC04R60D的Datasheet PDF文件第3页浏览型号IGC04R60D的Datasheet PDF文件第4页浏览型号IGC04R60D的Datasheet PDF文件第5页浏览型号IGC04R60D的Datasheet PDF文件第6页 
IGC04R60D  
TRENCHSTOPTM RC-Series for hard switching applications  
IGBT chip with monolithically integrated diode in packages offering space saving advantage  
Features:  
TRENCHSTOPTM Reverse Conducting (RC) technology for  
600V applications offering:  
• Optimised VCEsat and VF for low conduction losses  
• Smooth switching performance leading to low EMI levels  
• Very tight parameter distribution  
• Operating range of 1 to 20kHz  
• Maximum junction temperature 175°C  
• Short circuit capability of 5µs  
• Best in class current versus package size performance  
• Qualified according to JEDEC for target applications  
• Complete product spectrum and PSpice Models:  
http://www.infineon.com/igbt/  
Applications:  
Used for:  
Motor drives  
Discrete components and molded modules  
Chip Type  
VCE  
600V  
ICn  
4A  
Die Size  
1.98 x 1.85 mm2  
Package  
sawn on foil  
IGC04R60D  
Mechanical Parameter  
Raster size  
1.98 x 1.85  
Emitter pad size  
Gate pad size  
see chip drawing  
mm2  
see chip drawing  
Area: total / active IGBT / active Diode  
Thickness  
3.663 / 1.464 / 0.339  
70  
µm  
Wafer size  
150  
4154  
mm  
Max.possible chips per wafer  
Passivation frontside  
Pad metal  
Photoimide  
3200 nm AlSiCu  
Ni Ag –system  
Backside metal  
Die bond  
suitable for epoxy and soft solder die bonding  
Electrically conductive glue or solder  
Wire bond  
Al, <500µm  
Reject ink dot size  
0.65mm ; max 1.2mm  
Store in original container, in dry nitrogen, in dark  
Recommended storage environment  
environment, < 6 month at an ambient temperature of 23°C  
Edited by INFINEON Technologies, IFAG IMM PSD, Edition 2.0, 12.01.2010  

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