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IGC109T120T6RM PDF预览

IGC109T120T6RM

更新时间: 2024-11-05 11:19:19
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率控制双极性晶体管
页数 文件大小 规格书
5页 70K
描述
IGBT4 Medium Power Chip

IGC109T120T6RM 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:DIE
包装说明:UNCASED CHIP, R-XUUC-N4针数:5
Reach Compliance Code:compliant风险等级:5.6
最大集电极电流 (IC):110 A集电极-发射极最大电压:1200 V
配置:SINGLE门极发射器阈值电压最大值:6.5 V
门极-发射极最大电压:20 VJESD-30 代码:R-XUUC-N4
元件数量:1端子数量:4
最高工作温度:175 °C封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:UNCASED CHIP
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
认证状态:Not Qualified子类别:Insulated Gate BIP Transistors
表面贴装:YES端子形式:NO LEAD
端子位置:UPPER处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:POWER CONTROL晶体管元件材料:SILICON
Base Number Matches:1

IGC109T120T6RM 数据手册

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IGC109T120T6RM  
IGBT4 MediumPower Chip  
Features:  
·
·
·
·
·
1200V Trench + Field stop technology  
low switching losses  
soft turn off  
positive temperature coefficient  
easy paralleling  
This chip is used for:  
medium power modules  
C
E
·
Applications:  
medium power drives  
G
·
Chip Type  
VCE  
ICn  
Die Size  
Package  
IGC109T120T6RM 1200V 110A 7.48 x 14.61 mm2  
sawn on foil  
MECHANICAL PARAMETER  
Raster size  
7.48 x 14.61  
Emitter pad size (incl. gate pad)  
Gate pad size  
4 x (2.761 x 6.458)  
mm2  
0.811 x 1.31  
Area total / active  
Thickness  
109.3 / 82.6  
120  
150  
90  
µm  
mm  
grd  
Wafer size  
Flat position  
Max.possible chips per wafer  
Passivation frontside  
Pad metal  
126  
Photoimide  
3200 nm AlSiCu  
Ni Ag –system  
Backside metal  
Die bond  
suitable for epoxy and soft solder die bonding  
Electrically conductive glue or solder  
Wire bond  
Al, <500µm  
Reject ink dot size  
Æ 0.65mm ; max 1.2mm  
Store in original container, in dry nitrogen,  
< 6 month at an ambient temperature of 23°C  
Recommended storage environment  
Edited by INFINEON Technologies , AIM PMD D CID CLS , L7742B, Edition 1, 31.10.2007  

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