FQU3N25

更新时间： 2024-09-12 22:18:23

品牌	Logo	应用领域
飞兆/仙童 - FAIRCHILD		/
页数	文件大小	规格书
9页	669K
描述
250V N-Channel MOSFET

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数据手册

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FQU3N25 数据手册

November 2000

QFET

FQD3N25 / FQU3N25

250V N-Channel MOSFET

General Description

Features

These N-Channel enhancement mode power field effect

transistors are produced using Fairchild’s proprietary,

planar stripe, DMOS technology.

This advanced technology has been especially tailored to

minimize on-state resistance, provide superior switching

performance, and withstand high energy pulse in the

avalanche and commutation mode. These devices are well

suited for high efficiency switching DC/DC converters,

switch mode power supply.

•

2.4A, 250V, R

= 2.2Ω @V = 10 V

DS(on) GS

Low gate charge ( typical 4.0 nC)

Low Crss ( typical 4.7 pF)

Fast switching

100% avalanche tested

Improved dv/dt capability

! "

I-PAK

FQU Series

D-PAK

FQD Series

Absolute Maximum Ratings

T = 25°C unless otherwise noted

Symbol

Parameter

FQD3N25 / FQU3N25

Units

Drain-Source Voltage

250

2.4

DSS

- Continuous (T = 25°C)

Drain Current

- Continuous (T = 100°C)

1.5

(Note 1)

Drain Current

- Pulsed

9.6

Gate-Source Voltage

± 30

GSS

(Note 2)

(Note 1)

(Note 3)

Single Pulsed Avalanche Energy

Avalanche Current

2.4

Repetitive Avalanche Energy

Peak Diode Recovery dv/dt

3.0

V/ns

dv/dt

5.5

Power Dissipation (T = 25°C) *

2.5

Power Dissipation (T = 25°C)

- Derate above 25°C

Operating and Storage Temperature Range

0.24

-55 to +150

W/°C

°C

T , T

STG

Maximum lead temperature for soldering purposes,

300

°C

1/8" from case for 5 seconds

Thermal Characteristics

Symbol

Parameter

Typ

Max

4.17

Units

°C/W

Thermal Resistance, Junction-to-Case

Thermal Resistance, Junction-to-Ambient *

Thermal Resistance, Junction-to-Ambient

θJC

θJA

110

* When mounted on the minimum pad size recommended (PCB Mount)

Rev. A, November 2000

12 3 4 5 6 7...9

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