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FQU3N50CTU PDF预览

FQU3N50CTU

更新时间: 2024-11-21 03:25:07
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
9页 914K
描述
500V N-Channel MOSFET

FQU3N50CTU 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:TO-251
包装说明:IPAK-3针数:3
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.72
雪崩能效等级(Eas):200 mJ配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:500 V最大漏极电流 (Abs) (ID):2.5 A
最大漏极电流 (ID):2.5 A最大漏源导通电阻:2.5 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSIP-T3
JESD-609代码:e3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):35 W最大脉冲漏极电流 (IDM):10 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Matte Tin (Sn)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FQU3N50CTU 数据手册

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March 2008  
®
QFET  
FQD3N50C / FQU3N50C  
500V N-Channel MOSFET  
Features  
Description  
2.5A, 500V, RDS(on) = 2.5@VGS = 10 V  
Low gate charge ( typical 10 nC)  
Low Crss ( typical 8.5pF)  
Fast switching  
100% avalanche tested  
Improved dv/dt capability  
RoHS compliant  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary, planar  
stripe, DMOS technology.  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the avalanche  
and commutation mode. These devices are well suited for high  
efficient switched mode power supplies, active power factor  
correction, electronic lamp ballast based on half bridge  
topology.  
D
D
G
I-PAK  
FQU Series  
D-PAK  
FQD Series  
G
S
G D S  
S
Absolute Maximum Ratings  
Symbol  
Parameter  
Units  
V
FQD3N50C/FQU3N50C  
VDSS  
ID  
Drain-Source Voltage  
500  
2.5  
Drain Current  
- Continuous (TC = 25°C)  
- Continuous (TC = 100°C)  
- Pulsed  
A
1.5  
A
(Note 1)  
IDM  
Drain Current  
10  
A
VGSS  
EAS  
IAR  
Gate-Source Voltage  
± 30  
200  
V
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
2.5  
EAR  
dv/dt  
PD  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Power Dissipation (TC = 25°C)  
3.5  
mJ  
V/ns  
W
4.5  
35  
- Derate above 25°C  
0.28  
-55 to +150  
W/°C  
°C  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
Maximum lead temperature for soldering purposes,  
1/8" from case for 5 seconds  
300  
°C  
Thermal Characteristics  
Symbol  
Parameter  
Typ  
Max  
3.5  
Units  
°C/W  
°C/W  
°C/W  
RθJC  
RθJA  
RθJA  
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Ambient*  
Thermal Resistance, Junction-to-Ambient  
--  
--  
--  
50  
110  
* When mounted on the minimum pad size recommended (PCB Mount)  
©2008 Fairchild Semiconductor Corporation  
FQD3N50C / FQU3N50C Rev. B  
1
www.fairchildsemi.com  

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