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FQP12N20J69Z PDF预览

FQP12N20J69Z

更新时间: 2024-11-16 14:50:19
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 局域网开关脉冲晶体管
页数 文件大小 规格书
7页 536K
描述
Power Field-Effect Transistor, 11.6A I(D), 200V, 0.28ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220, 3 PIN

FQP12N20J69Z 技术参数

生命周期:Obsolete零件包装代码:SFM
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.76雪崩能效等级(Eas):210 mJ
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:200 V
最大漏极电流 (ID):11.6 A最大漏源导通电阻:0.28 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):46.4 A认证状态:Not Qualified
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FQP12N20J69Z 数据手册

 浏览型号FQP12N20J69Z的Datasheet PDF文件第2页浏览型号FQP12N20J69Z的Datasheet PDF文件第3页浏览型号FQP12N20J69Z的Datasheet PDF文件第4页浏览型号FQP12N20J69Z的Datasheet PDF文件第5页浏览型号FQP12N20J69Z的Datasheet PDF文件第6页浏览型号FQP12N20J69Z的Datasheet PDF文件第7页 
QFET N-CHANNEL  
FEATURES  
FQP12N20  
BV  
= 200V  
DSS  
Advanced New Design  
R
= 0.28Ω  
DS(ON)  
Avanced Rugged Technology  
Rugged Gate Oxide Technology  
Very Low Intrinsic Capacitances  
Excellent Switching Characteristics  
Unrivalled Gate Charge: 18nC (Typ.)  
Extended Safe Operating Area  
I = 11.6A  
D
TO-220  
1
2
3
Lower R  
: 0.21(Typ.)  
DS(ON)  
1. Gate 2. Drain 3. Source  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Characteristics  
Drain-to-Source Voltage  
Continuous Drain Current (T = 25°C)  
Value  
200  
11.6  
7.35  
46.4  
±30  
210  
11.6  
9.0  
Units  
V
V
DSS  
C
I
A
D
Continuous Drain Current (T = 100°C)  
C
I
Drain Current-Pulsed  
V
J
DM  
V
Gate-to-Source Voltage  
Single Pulsed Avalanche Energy  
Avalanche Current  
GS  
AS  
AR  
E
mJ  
A
I
E
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
mJ  
V/ns  
AR  
dv/dt  
5.5  
Total Power Dissipation (T = 25°C)  
Linear Derating Factor  
90  
0.72  
W
W/°C  
C
P
D
Operating Junction and Storage  
Temperature Range  
T , T  
55 to +150  
J
STG  
°C  
Maximum Lead Temp. for Soldering  
Purposes, 1/8” from case for 5-seconds  
T
300  
L
THERMAL RESISTANCE  
Symbol  
Characteristics  
Junction-to-Case  
Case-to-Sink  
Typ.  
Max.  
Units  
R
0.5  
1.39  
θJC  
R
°C/W  
θCS  
R
Junction-to-Ambient  
62.5  
θJA  
REV. B  
1
1999 Fairchild Semiconductor Corporation  

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