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FDP13N50F PDF预览

FDP13N50F

更新时间: 2024-11-23 03:36:27
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
9页 621K
描述
N-Channel MOSFET 500V, 12A, 0.54ヘ

FDP13N50F 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TO-220AB包装说明:ROHS COMPLIANT, TO-220, 3 PIN
针数:3Reach Compliance Code:compliant
风险等级:5.84雪崩能效等级(Eas):684 mJ
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:500 V
最大漏极电流 (Abs) (ID):12 A最大漏极电流 (ID):12 A
最大漏源导通电阻:0.54 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):195 W
最大脉冲漏极电流 (IDM):48 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDP13N50F 数据手册

 浏览型号FDP13N50F的Datasheet PDF文件第2页浏览型号FDP13N50F的Datasheet PDF文件第3页浏览型号FDP13N50F的Datasheet PDF文件第4页浏览型号FDP13N50F的Datasheet PDF文件第5页浏览型号FDP13N50F的Datasheet PDF文件第6页浏览型号FDP13N50F的Datasheet PDF文件第7页 
September 2007  
UniFETTM  
FDP13N50F / FDPF13N50FT  
tm  
N-Channel MOSFET  
500V, 12A, 0.54Ω  
Features  
Description  
RDS(on) = 0.42( Typ.)@ VGS = 10V, ID = 6A  
Low gate charge ( Typ. 30nC)  
Low Crss ( Typ. 14.5pF)  
Fast switching  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary, planar  
stripe, DMOS technology.  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the avalanche  
and commutation mode. These devices are well suited for high  
efficient switched mode power supplies and active power factor  
correction.  
100% avalanche tested  
Improved dv/dt capability  
RoHS compliant  
D
G
TO-220  
FDP Series  
TO-220F  
FDPF Series  
G D S  
G
S
D
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted*  
Symbol  
VDSS  
VGSS  
Parameter  
FDP13N50F FDPF13N50FT Units  
Drain to Source Voltage  
Gate to Source Voltage  
500  
±30  
V
V
-Continuous (TC = 25oC)  
-Continuous (TC = 100oC)  
- Pulsed  
12  
7.2  
48  
12*  
7.2*  
48*  
ID  
Drain Current  
A
IDM  
Drain Current  
(Note 1)  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
A
mJ  
A
EAS  
IAR  
Single Pulsed Avalanche Energy  
Avalanche Current  
684  
12  
EAR  
dv/dt  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
19.5  
4.5  
mJ  
V/ns  
W
(TC = 25oC)  
- Derate above 25oC  
195  
42  
PD  
Power Dissipation  
1.53  
0.33  
W/oC  
oC  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
-55 to +150  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
300  
oC  
*Drain current limited by maximum junction temperature  
Thermal Characteristics  
Symbol  
Parameter  
Thermal Resistance, Junction to Case  
FDP13N50F FDPF13N50FT Units  
RθJC  
RθCS  
RθJA  
0.65  
0.5  
3.0  
-
Thermal Resistance, Case to Sink Typ.  
Thermal Resistance, Junction to Ambient  
oC/W  
62.5  
62.5  
©2007 Fairchild Semiconductor Corporation  
FDP13N50F / FDPF13N50FT Rev. A  
1
www.fairchildsemi.com  

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