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FDP16N50 PDF预览

FDP16N50

更新时间: 2024-11-23 03:06:27
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
10页 994K
描述
500V N-Channel MOSFET

FDP16N50 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:TO-220AB
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.79雪崩能效等级(Eas):780 mJ
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:500 V
最大漏极电流 (Abs) (ID):16 A最大漏极电流 (ID):16 A
最大漏源导通电阻:0.38 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
JESD-609代码:e3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT APPLICABLE极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):200 W最大脉冲漏极电流 (IDM):64 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Matte Tin (Sn)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT APPLICABLE晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDP16N50 数据手册

 浏览型号FDP16N50的Datasheet PDF文件第2页浏览型号FDP16N50的Datasheet PDF文件第3页浏览型号FDP16N50的Datasheet PDF文件第4页浏览型号FDP16N50的Datasheet PDF文件第5页浏览型号FDP16N50的Datasheet PDF文件第6页浏览型号FDP16N50的Datasheet PDF文件第7页 
February 2007  
TM  
UniFET  
FDP16N50 / FDPF16N50  
500V N-Channel MOSFET  
Features  
Description  
16A, 500V, RDS(on) = 0.38@VGS = 10 V  
Low gate charge ( typical 32 nC)  
Low Crss ( typical 20 pF)  
Fast switching  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary, planar  
stripe, DMOS technology.  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the avalanche  
and commutation mode. These devices are well suited for high  
efficient switched mode power supplies and active power factor  
correction.  
100% avalanche tested  
Improved dv/dt capability  
D
G
TO-220F  
FDPF Series  
S
TO-220  
FDP Series  
G D  
S
G
D S  
Absolute Maximum Ratings  
Symbol  
Parameter  
FDP16N50 FDPF16N50  
Unit  
VDSS  
Drain-Source Voltage  
Drain Current  
500  
V
ID  
- Continuous (TC = 25°C)  
- Continuous (TC = 100°C)  
16  
9.6  
16 *  
9.6 *  
A
A
(Note 1)  
(Note 2)  
IDM  
Drain Current  
- Pulsed  
64  
64 *  
A
V
VGSS  
EAS  
IAR  
Gate-Source voltage  
±30  
780  
16  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
(Note 1)  
(Note 1)  
(Note 3)  
EAR  
dv/dt  
PD  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
20  
mJ  
V/ns  
4.5  
Power Dissipation  
(TC = 25°C)  
200  
52  
W
- Derate above 25°C  
1.59  
0.41  
W/°C  
T
J, TSTG  
Operating and Storage Temperature Range  
-55 to +150  
300  
°C  
TL  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
°C  
* Drain current limited by maximum junction temperature  
Thermal Characteristics  
Symbol  
Parameter  
FDP16N50 FDPF16N50  
Unit  
°C/W  
°C/W  
°C/W  
RθJC  
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Case-to-Sink Typ.  
Thermal Resistance, Junction-to-Ambient  
0.63  
0.5  
2.4  
--  
RθCS  
RθJA  
62.5  
62.5  
©2007 Fairchild Semiconductor Corporation  
FDP16N50 / FDPF16N50 Rev. B  
1
www.fairchildsemi.com  

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