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FDP19N40 PDF预览

FDP19N40

更新时间: 2024-11-23 06:59:07
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管开关脉冲局域网
页数 文件大小 规格书
9页 260K
描述
N-Channel MOSFET 400V, 19A, 0.24Ω

FDP19N40 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:TO-220
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.73
雪崩能效等级(Eas):542 mJ配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:400 V最大漏极电流 (Abs) (ID):19 A
最大漏极电流 (ID):19 A最大漏源导通电阻:0.24 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-220AB
JESD-30 代码:R-PSFM-T3JESD-609代码:e3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):215 W
最大脉冲漏极电流 (IDM):76 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Matte Tin (Sn)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDP19N40 数据手册

 浏览型号FDP19N40的Datasheet PDF文件第2页浏览型号FDP19N40的Datasheet PDF文件第3页浏览型号FDP19N40的Datasheet PDF文件第4页浏览型号FDP19N40的Datasheet PDF文件第5页浏览型号FDP19N40的Datasheet PDF文件第6页浏览型号FDP19N40的Datasheet PDF文件第7页 
October  
UniFETTM  
FDP19N40 / FDPF19N40  
tm  
N-Channel MOSFET  
400V, 19A, 0.24Ω  
Features  
Description  
RDS(on) =0.2Ω ( Typ.)@ VGS = 10V, ID = 9.5A  
Low Gate Charge ( Typ. 32nC)  
Low Crss ( Typ. 20pF)  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary, planar  
stripe, DMOS technology.  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pluse in the avalanche  
and commutation mode. These devices are well suited for high  
efficient switched mode power suppliesand active power  
factor correction.  
Fast Switching  
100% Avalanche Tested  
Improved dv/dt Capability  
RoHS Compliant  
D
G
TO-220  
FDP Series  
TO-220F  
FDPF Series  
G
D S  
G D S  
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted*  
Symbol  
VDSS  
VGSS  
Parameter  
FDP19N40  
FDPF19N40  
400  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
V
V
±30  
-Continuous (TC = 25oC)  
-Continuous (TC = 100oC)  
- Pulsed  
19  
11.4  
76  
19*  
11.4*  
76*  
ID  
Drain Current  
A
IDM  
Drain Current  
(Note 1)  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
A
mJ  
A
EAS  
IAR  
Single Pulsed Avalanche Energy  
Avalanche Current  
542  
19  
EAR  
dv/dt  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
21.5  
15  
mJ  
V/ns  
W
W/oC  
oC  
(TC = 25oC)  
- Derate above 25oC  
215  
40  
PD  
Power Dissipation  
1.65  
0.3  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
-55 to +150  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
300  
oC  
*Drain current limited by maximum junction temperature  
Thermal Characteristics  
Symbol  
Parameter  
Thermal Resistance, Junction to Case  
FDP19N40  
FDPF19N40  
Units  
RθJC  
RθCS  
RθJA  
0.6  
0.5  
3.0  
-
Thermal Resistance, Case to Sink Typ.  
Thermal Resistance, Junction to Ambient  
oC/W  
62.5  
62.5  
©2008 Fairchild Semiconductor Corporation  
FDP19N40 / FDPF19N40 Rev. A  
1
www.fairchildsemi.com  

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