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FDP22N50N PDF预览

FDP22N50N

更新时间: 2024-11-26 06:59:07
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
8页 559K
描述
N-Channel MOSFET 500V, 22A, 0.22Ω

FDP22N50N 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:TO-220
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.7
Is Samacsys:N雪崩能效等级(Eas):1000 mJ
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:500 V
最大漏极电流 (Abs) (ID):22 A最大漏极电流 (ID):22 A
最大漏源导通电阻:0.22 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
JESD-609代码:e3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):312.5 W最大脉冲漏极电流 (IDM):88 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Matte Tin (Sn)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDP22N50N 数据手册

 浏览型号FDP22N50N的Datasheet PDF文件第2页浏览型号FDP22N50N的Datasheet PDF文件第3页浏览型号FDP22N50N的Datasheet PDF文件第4页浏览型号FDP22N50N的Datasheet PDF文件第5页浏览型号FDP22N50N的Datasheet PDF文件第6页浏览型号FDP22N50N的Datasheet PDF文件第7页 
April 2009  
TM  
UniFET  
FDP22N50N  
N-Channel MOSFET  
500V, 22A, 0.22Ω  
Features  
Description  
RDS(on) = 0.185( Typ.)@ VGS = 10V, ID = 11A  
Low gate charge ( Typ. 49nC)  
Low Crss ( Typ. 24pF)  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary, planar  
stripe, DMOS technology.  
This advanced technology has been especially tailored to mini-  
mize on-state resistance, provide superior switching perfor-  
mance, and withstand high energy pulse in the avalanche and  
commutation mode. These devices are well suited for high  
efficient switching mode power supplies and active power factor  
correction.  
Fast switching  
100% avalanche tested  
Improve dv/dt capability  
RoHS compliant  
D
G
TO-220  
FDP Series  
G
D S  
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted  
Symbol  
VDSS  
VGSS  
Parameter  
FDP22N50N  
500  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
V
V
±30  
-Continuous (TC = 25oC)  
-Continuous (TC = 100oC)  
- P ul s ed  
22  
ID  
D r a in C u r r e n t  
A
13.2  
IDM  
D rai n Cur rent  
(Note 1)  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
88  
A
mJ  
A
EAS  
IAR  
Single Pulsed Avalanche Energy  
Avalanche Current  
1000  
22  
EAR  
dv/dt  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
31.25  
10  
mJ  
V/ns  
W
W/oC  
oC  
(TC = 25oC)  
- Derate above 25oC  
312.5  
2.5  
PD  
Power Dissipation  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
-55 to +150  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
300  
oC  
*Drain current limited by maximum junction temperature  
Thermal Characteristics  
Symbol  
Parameter  
Thermal Resistance, Junction to Case  
FDP22N50N  
Units  
RθJC  
RθCS  
RθJA  
0.4  
0.5  
Thermal Resistance, Case to Sink Typ.  
Thermal Resistance, Junction to Ambient  
oC/W  
62.5  
©2009 Fairchild Semiconductor Corporation  
FDP22N50N Rev. A  
1
www.fairchildsemi.com  

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