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FDP18N20F PDF预览

FDP18N20F

更新时间: 2024-11-26 03:36:27
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
9页 502K
描述
N-Channel MOSFET, FRFET 200V, 18A, 0.145ヘ

FDP18N20F 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:TO-220
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.72
雪崩能效等级(Eas):324 mJ配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:200 V最大漏极电流 (Abs) (ID):18 A
最大漏极电流 (ID):18 A最大漏源导通电阻:0.145 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-220AB
JESD-30 代码:R-PSFM-T3JESD-609代码:e3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):100 W
最大脉冲漏极电流 (IDM):72 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Matte Tin (Sn)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDP18N20F 数据手册

 浏览型号FDP18N20F的Datasheet PDF文件第2页浏览型号FDP18N20F的Datasheet PDF文件第3页浏览型号FDP18N20F的Datasheet PDF文件第4页浏览型号FDP18N20F的Datasheet PDF文件第5页浏览型号FDP18N20F的Datasheet PDF文件第6页浏览型号FDP18N20F的Datasheet PDF文件第7页 
November 2007  
TM  
UniFET  
FDP18N20F / FDPF18N20F  
N-Channel MOSFET, FRFET  
200V, 18A, 0.145Ω  
tm  
Features  
Description  
RDS(on) = 0.12( Typ.)@ VGS = 10V, ID = 9A  
Low gate charge ( Typ. 20nC)  
Low Crss ( Typ. 24pF)  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary, planar  
stripe, DMOS technology.  
This advanced technology has been especially tailored to mini-  
mize on-state resistance, provide superior switching perfor-  
mance, and withstand high energy pulse in the avalanche and  
commutation mode. These devices are well suited for high  
efficient switching mode power supplies and active power factor  
correction.  
Fast switching  
100% avalanche tested  
Improve dv/dt capability  
RoHS compliant  
D
G
TO-220F  
FDPF Series  
TO-220  
FDP Series  
G D S  
G D S  
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted  
Symbol  
VDSS  
VGSS  
Parameter  
FDP18N20F FDPF18N20F  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
200  
±30  
V
V
-Continuous (TC = 25oC)  
-Continuous (TC = 100oC)  
- P uls ed  
18  
10.8  
72  
18*  
10.8*  
72*  
ID  
D r a in C u r r e n t  
A
IDM  
D rai n Cur rent  
(Note 1)  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
A
mJ  
A
EAS  
IAR  
Single Pulsed Avalanche Energy  
Avalanche Current  
324  
18  
EAR  
dv/dt  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
10  
mJ  
V/ns  
W
W/oC  
oC  
4.5  
(TC = 25oC)  
- Derate above 25oC  
100  
35  
PD  
Power Dissipation  
0.83  
0.27  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
-55 to +150  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
300  
oC  
*Drain current limited by maximum junction temperature  
Thermal Characteristics  
Symbol  
Parameter  
Thermal Resistance, Junction to Case  
FDP18N20F FDPF18N20F  
Units  
RθJC  
RθCS  
RθJA  
1.2  
0.5  
3.6  
-
Thermal Resistance, Case to Sink Typ.  
Thermal Resistance, Junction to Ambient  
oC/W  
62.5  
62.5  
©2007 Fairchild Semiconductor Corporation  
FDP18N20F / FDPF18N20F Rev. A  
1
www.fairchildsemi.com  

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