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FDP050AN06A0

更新时间: 2024-11-22 22:31:47
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管开关局域网
页数 文件大小 规格书
11页 557K
描述
N-Channel PowerTrench MOSFET

FDP050AN06A0 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:TO-220
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.21
雪崩能效等级(Eas):470 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (Abs) (ID):18 A最大漏极电流 (ID):18 A
最大漏源导通电阻:0.005 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
JESD-609代码:e3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):245 W认证状态:Not Qualified
子类别:FET General Purpose Powers表面贴装:NO
端子面层:Matte Tin (Sn)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDP050AN06A0 数据手册

 浏览型号FDP050AN06A0的Datasheet PDF文件第2页浏览型号FDP050AN06A0的Datasheet PDF文件第3页浏览型号FDP050AN06A0的Datasheet PDF文件第4页浏览型号FDP050AN06A0的Datasheet PDF文件第5页浏览型号FDP050AN06A0的Datasheet PDF文件第6页浏览型号FDP050AN06A0的Datasheet PDF文件第7页 
February 2003  
FDB050AN06A0 / FDP050AN06A0  
®
N-Channel PowerTrench MOSFET  
60V, 80A, 5mΩ  
Features  
Applications  
rDS(ON) = 4.3m(Typ.), VGS = 10V, ID = 80A  
Motor / Body Load Control  
Qg(tot) = 61nC (Typ.), VGS = 10V  
ABS Systems  
• Low Miller Charge  
Powertrain Management  
Injection Systems  
Low QRR Body Diode  
UIS Capability (Single Pulse and Repetitive Pulse)  
Qualified to AEC Q101  
DC-DC converters and Off-line UPS  
Distributed Power Architectures and VRMs  
Primary Switch for 12V and 24V systems  
Formerly developmental type 82575  
D
DRAIN  
(FLANGE)  
GATE  
SOURCE  
DRAIN  
GATE  
G
DRAIN  
SOURCE  
TO-263AB  
FDB SERIES  
(FLANGE)  
TO-220AB  
FDP SERIES  
S
MOSFET Maximum Ratings TC = 25°C unless otherwise noted  
Symbol  
VDSS  
VGS  
Parameter  
Ratings  
60  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
Drain Current  
V
V
20  
Continuous (TC < 135oC, VGS = 10V)  
Continuous (TA = 25oC, VGS = 10V, RθJA = 43oC/W)  
Pulsed  
80  
A
ID  
18  
Figure 4  
470  
A
A
EAS  
Single Pulse Avalanche Energy (Note 1)  
mJ  
Power dissipation  
Derate above 25oC  
245  
W
PD  
1.63  
W/oC  
oC  
TJ, TSTG  
Operating and Storage Temperature  
-55 to 175  
Thermal Characteristics  
RθJC  
RθJA  
RθJA  
Thermal Resistance Junction to Case TO-220,TO-263  
Thermal Resistance Junction to Ambient TO-220,TO-263 (Note 2)  
Thermal Resistance Junction to Ambient TO-263, 1in2 copper pad area  
0.61  
62  
oC/W  
oC/W  
oC/W  
43  
This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For a  
copy of the requirements, see AEC Q101 at: http://www.aecouncil.com/  
Reliability data can be found at: http://www.fairchildsemi.com/products/discrete/reliability/index.html.  
All Fairchild Semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems  
certification.  
©2003 Fairchild Semiconductor Corporation  
FDB050AN06A0 / FDP050AN06A0 Rev. A  

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