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FDMC7572S PDF预览

FDMC7572S

更新时间: 2024-11-20 12:23:35
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
8页 323K
描述
N-Channel Power Trench® SyncFETTM 25 V, 40 A, 3.15 mΩ

FDMC7572S 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:QFN
包装说明:ROHS COMPLIANT, POWER 33, 8 PIN针数:8
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.71
雪崩能效等级(Eas):84 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:25 V
最大漏极电流 (Abs) (ID):103 A最大漏极电流 (ID):22.5 A
最大漏源导通电阻:0.00315 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:MO-240BAJESD-30 代码:S-PDSO-N5
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:5
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:SQUARE
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):52 W
最大脉冲漏极电流 (IDM):120 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:NO LEAD
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDMC7572S 数据手册

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August 2011  
FDMC7572S  
N-Channel Power Trench® SyncFETTM  
25 V, 40 A, 3.15 mΩ  
Features  
General Description  
„ Max rDS(on) = 3.15 mΩ at VGS = 10 V, ID = 22.5 A  
The FDMC7572S has been designed to minimize losses in  
power conversion application. Advancements in both silicon and  
package technologies have been combined to offer the lowest  
rDS(on) while maintaining excellent switching performance. This  
device has the added benefit of an efficient monolithic Schottky  
body diode.  
„ Max rDS(on) = 4.7 mΩ at VGS = 4.5 V, ID = 18 A  
„ Advanced Package and Silicon combination for low rDS(on)  
and high efficiency  
„ SyncFET Schottky Body Diode  
„ 100% UIL Tested  
Applications  
„ Synchronous Rectifier for DC/DC Converters  
„ RoHS Compliant  
„ Notebook Vcore/ GPU low side switch  
„ Networking Point of Load low side switch  
„ Telecom secondary side rectification  
Bottom  
S
Top  
Pin 1  
D
D
D
G
5
6
7
8
4
3
2
1
S
S
S
S
S
G
D
D
D
D
D
Power 33  
MOSFET Maximum Ratings TA = 25 °C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Ratings  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
25  
±20  
V
V
(Note 4)  
Drain Current -Continuous (Package limited)  
-Continuous (Silicon limited)  
-Continuous  
TC = 25 °C  
C = 25 °C  
40  
T
103  
ID  
A
TA = 25 °C  
(Note 1a)  
(Note 3)  
22.5  
120  
-Pulsed  
EAS  
Single Pulse Avalanche Energy  
Power Dissipation  
84  
mJ  
W
TC = 25 °C  
TA = 25 °C  
52  
PD  
Power Dissipation  
(Note 1a)  
2.3  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
-55 to +150  
°C  
Thermal Characteristics  
RθJC  
RθJA  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
2.4  
53  
°C/W  
(Note 1a)  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
13 ’’  
Tape Width  
12 mm  
Quantity  
FDMC7572S  
FDMC7572S  
Power 33  
3000 units  
1
©2011 Fairchild Semiconductor Corporation  
FDMC7572S Rev.C1  
www.fairchildsemi.com  

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