FDMC7570S
MOSFET – N-Channel,
POWERTRENCH),
SyncFETt
25 V, 40 A, 2 mW
www.onsemi.com
General Description
The FDMC7570S has been designed to minimize losses in power
conversion application. Advancements in both silicon and package
Pin 1
technologies have been combined to offer the lowest R
while
DS(on)
maintaining excellent switching performance. This device has the
added benefit of an efficient monolithic Schottky body diode.
Features
Power 33
PQFN8
CASE 483AK
• Max R
• Max R
= 2 mW at V = 10 V, I = 27 A
GS D
DS(on)
= 2.9 mW at V = 4.5 V, I = 21.5 A
DS(on)
GS
D
• Advanced Package and Combination for Low R
Efficiency
and High
DS(on)
PIN ASSIGNMENT
• SyncFET Schottky Body Diode
• 100% UIL Tested
D
5
4
G
• These Devices are Pb−Free and are RoHS Compliant
D
D
6
7
3
2
S
S
Applications
• Synchronous Rectifier for DC/DC Converters
• Notebook Vcore/GPU Low Side Switch
• Networking Point of Load Low Side Switch
• Telecom Secondary Side Rectification
D
8
1
S
MARKING DIAGRAM
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
A
Parameter
Drain to Source Voltage
Symbol
Rating
Unit
V
V
DS
V
GS
25
20
&Y&Z&3&K
FDMC
Gate to Source Voltage (Note 4)
V
7570S
I
D
A
Drain Current
− Continuous (Package limited) T = 25°C
40
132
27
C
− Continuous (Silicon limited) T = 25°C
C
− Continuous T = 25°C (Note 1a)
A
− Pulsed
120
&Y
&Z
&3
&K
= ON Semiconductor Logo
= Assembly Plant Code
= 3−Digit Data Code
Single Pulse Avalanche Energy (Note 3)
E
AS
144
59
mJ
W
P
D
Power Dissipation
T = 25°C
C
= 2−Digit Lot Traceability Code
FDMC7570S
= Specific Device Code
Power Dissipation T = 25°C (Note 1a)
2.3
A
Operating and Storage Junction
Temperature Range
T , T
−55 to +150
°C
J
STG
ORDERING INFORMATION
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
†
Device
Package
Shipping
FDMC7570S
PGFN8
3,000 /
(Pb−Free)
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2009
1
Publication Order Number:
June, 2019 − Rev. 3
FDMC7570S/D