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FDMC7570S PDF预览

FDMC7570S

更新时间: 2024-11-19 11:11:51
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 478K
描述
N 沟道 Power Trench® SyncFET™ 25V,40A,2mΩ

FDMC7570S 数据手册

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FDMC7570S  
MOSFET – N-Channel,  
POWERTRENCH),  
SyncFETt  
25 V, 40 A, 2 mW  
www.onsemi.com  
General Description  
The FDMC7570S has been designed to minimize losses in power  
conversion application. Advancements in both silicon and package  
Pin 1  
technologies have been combined to offer the lowest R  
while  
DS(on)  
maintaining excellent switching performance. This device has the  
added benefit of an efficient monolithic Schottky body diode.  
Features  
Power 33  
PQFN8  
CASE 483AK  
Max R  
Max R  
= 2 mW at V = 10 V, I = 27 A  
GS D  
DS(on)  
= 2.9 mW at V = 4.5 V, I = 21.5 A  
DS(on)  
GS  
D
Advanced Package and Combination for Low R  
Efficiency  
and High  
DS(on)  
PIN ASSIGNMENT  
SyncFET Schottky Body Diode  
100% UIL Tested  
D
5
4
G
These Devices are PbFree and are RoHS Compliant  
D
D
6
7
3
2
S
S
Applications  
Synchronous Rectifier for DC/DC Converters  
Notebook Vcore/GPU Low Side Switch  
Networking Point of Load Low Side Switch  
Telecom Secondary Side Rectification  
D
8
1
S
MARKING DIAGRAM  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
A
Parameter  
Drain to Source Voltage  
Symbol  
Rating  
Unit  
V
V
DS  
V
GS  
25  
20  
&Y&Z&3&K  
FDMC  
Gate to Source Voltage (Note 4)  
V
7570S  
I
D
A
Drain Current  
Continuous (Package limited) T = 25°C  
40  
132  
27  
C
Continuous (Silicon limited) T = 25°C  
C
Continuous T = 25°C (Note 1a)  
A
Pulsed  
120  
&Y  
&Z  
&3  
&K  
= ON Semiconductor Logo  
= Assembly Plant Code  
= 3Digit Data Code  
Single Pulse Avalanche Energy (Note 3)  
E
AS  
144  
59  
mJ  
W
P
D
Power Dissipation  
T = 25°C  
C
= 2Digit Lot Traceability Code  
FDMC7570S  
= Specific Device Code  
Power Dissipation T = 25°C (Note 1a)  
2.3  
A
Operating and Storage Junction  
Temperature Range  
T , T  
55 to +150  
°C  
J
STG  
ORDERING INFORMATION  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
Device  
Package  
Shipping  
FDMC7570S  
PGFN8  
3,000 /  
(PbFree)  
Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2009  
1
Publication Order Number:  
June, 2019 Rev. 3  
FDMC7570S/D  

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