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FDG316P PDF预览

FDG316P

更新时间: 2024-11-10 11:11:59
品牌 Logo 应用领域
安森美 - ONSEMI PC开关光电二极管晶体管
页数 文件大小 规格书
7页 300K
描述
P 沟道,逻辑电平,PowerTrench® MOSFET,-30 V,-1.6 A,190 mΩ

FDG316P 技术参数

是否无铅: 不含铅生命周期:Lifetime Buy
包装说明:SMALL OUTLINE, R-PDSO-G6Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.21.00.95
Factory Lead Time:1 week风险等级:0.95
Samacsys Confidence:4Samacsys Status:Released
Samacsys PartID:438616Samacsys Pin Count:6
Samacsys Part Category:MOSFET (P-Channel)Samacsys Package Category:SOT23 (6-Pin)
Samacsys Footprint Name:SC-88 (SC-70 6 LEAD)Samacsys Released Date:2017-11-06 15:56:42
Is Samacsys:N配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):1.6 A
最大漏极电流 (ID):1.6 A最大漏源导通电阻:0.19 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PDSO-G6
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:6
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):0.75 W
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子面层:Tin (Sn)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDG316P 数据手册

 浏览型号FDG316P的Datasheet PDF文件第2页浏览型号FDG316P的Datasheet PDF文件第3页浏览型号FDG316P的Datasheet PDF文件第4页浏览型号FDG316P的Datasheet PDF文件第5页浏览型号FDG316P的Datasheet PDF文件第6页浏览型号FDG316P的Datasheet PDF文件第7页 
MOSFET– P-Channel, Logic  
Level, POWERTRENCH)  
FDG316P  
General Description  
This PChannel Logic Level MOSFET is produced using  
ON Semiconductor’s advanced POWERTRENCH process that has  
been especially tailored to minimize onstate resistance and yet  
maintain superior switching performance.  
These devices are well suited for low voltage and battery powered  
applications where low inline power loss and fast switching are  
required.  
www.onsemi.com  
S
D
D
G
D
D
Features  
SC88/SC706/SOT363  
CASE 419B02  
1.6 A, 30 V  
R  
R  
= 0.19 W @ V = 10 V  
GS  
DS(ON)  
= 0.30 W @ V = 4.5 V  
DS(ON)  
GS  
MARKING DIAGRAM  
Low Gate Charge (3.5 nC Typical)  
High Performance Trench Technology for Extremely Low R  
Compact Industry Standard SC706 Surface Mount Package  
These Devices are PbFree and are RoHS Compliant  
DS(ON)  
36M  
Applications  
36  
M
= Specific Device Code  
= Assembly Operation Month  
DC/DC Converter  
Load Switch  
Power Management  
PIN CONNECTIONS  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
A
1
6
5
4
Symbol  
Parameter  
DrainSource Voltage  
Ratings  
30  
Units  
V
DSS  
V
GSS  
V
V
A
2
3
GateSource Voltage  
20  
I
D
Drain Current  
Continuous  
(Note 1a)  
1.6  
Pulsed  
6  
0.75  
P
Power Dissipation for  
Single Operation  
(Note 1a)  
(Note 1b)  
W
D
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
0.48  
T , T  
J
Operating and Storage Junction  
Temperature Range  
55 to +150  
°C  
stg  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Ratings  
Unit  
R
Thermal Resistance, JunctiontoAmbient (Note 1b)  
260  
_C/W  
q
JA  
1. R  
is the sum of the junctiontocase and casetoambient thermal resistance where the case thermal reference is defined as the solder  
q
JA  
mounting surface of the drain pins. R  
is guaranteed by design while R  
is determined by the user’s board design.  
q
q
JC  
CA  
2
a) 170°C/W when mounted on a 1 in pad of 2 oz copper.  
b) 260°C/W when mounted on a minimum pad.  
© Semiconductor Components Industries, LLC, 2000  
1
Publication Order Number:  
FDG316P/D  
June, 2020 Rev. 4  
 

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