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FDD6632_04 PDF预览

FDD6632_04

更新时间: 2024-11-09 04:18:35
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
11页 268K
描述
N-Channel Logic Level UltraFET㈢ Trench Power MOSFET 30V, 9A, 70mз

FDD6632_04 数据手册

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October 2004  
FDD6632  
®
N-Channel Logic Level UltraFET Trench Power MOSFET  
30V, 9A, 70mΩ  
General Description  
Features  
This device employs a new advanced trench MOSFET  
technology and features low gate charge while maintaining  
low on-resistance.  
Fast switching  
r
r
= 0.058(Typ), V = 10V, I = 9A  
GS D  
DS(ON)  
DS(ON)  
= 0.090(Typ), V = 4.5V, I = 6A  
Optimized for switching applications, this device improves  
the overall efficiency of DC/DC converters and allows  
operation to higher switching frequencies.  
GS  
D
Q
Q
(Typ) = 2.6nC, V = 5V  
g(TOT)  
GS  
(Typ) = 0.8nC  
gd  
Formerly developmental type 83317  
C
(Typ) = 255pF  
ISS  
Applications  
DC/DC converters  
D
D
G
S
G
D-PAK  
(TO-252)  
S
MOSFET Maximum Ratings T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
Ratings  
30  
Units  
V
V
Drain to Source Voltage  
Gate to Source Voltage  
V
V
DSS  
GS  
±20  
Drain Current  
o
9
A
A
Continuous (T = 25 C, V = 10V)  
C
GS  
o
I
Continuous (T = 100 C, V = 4.5V)  
6
4
D
C
GS  
o
o
Continuous (T = 25 C, V = 10V, R = 52 C/W)  
θJA  
A
C
GS  
Pulsed  
Figure 4  
15  
A
Power dissipation  
W
P
D
o
o
Derate above 25 C  
0.1  
W/ C  
o
T , T  
Operating and Storage Temperature  
-55 to 175  
C
J
STG  
Thermal Characteristics  
o
R
R
R
Thermal Resistance Junction to Case TO-252  
Thermal Resistance Junction to Ambient TO-252  
10  
100  
52  
C/W  
θJC  
θJA  
θJA  
o
C/W  
2
o
Thermal Resistance Junction to Ambient TO-252, 1in copper pad area  
C/W  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
Tape Width  
16mm  
Quantity  
2500 units  
FDD6632  
FDD6632  
TO-252AA  
330mm  
©2004 Fairchild Semiconductor Corporation  
FDD6632 Rev. B1  

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