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FDD5N50NZTM PDF预览

FDD5N50NZTM

更新时间: 2024-11-20 11:59:23
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
8页 519K
描述
N-Channel MOSFET 500V, 4A, 1.5

FDD5N50NZTM 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:DPAK
包装说明:ROHS COMPLIANT, DPAK-3针数:3
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.69
Is Samacsys:N雪崩能效等级(Eas):304 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:500 V最大漏极电流 (Abs) (ID):4 A
最大漏极电流 (ID):4 A最大漏源导通电阻:1.5 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-252
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):62 W最大脉冲漏极电流 (IDM):16 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDD5N50NZTM 数据手册

 浏览型号FDD5N50NZTM的Datasheet PDF文件第2页浏览型号FDD5N50NZTM的Datasheet PDF文件第3页浏览型号FDD5N50NZTM的Datasheet PDF文件第4页浏览型号FDD5N50NZTM的Datasheet PDF文件第5页浏览型号FDD5N50NZTM的Datasheet PDF文件第6页浏览型号FDD5N50NZTM的Datasheet PDF文件第7页 
November 2011  
TM  
UniFET-II  
FDD5N50NZ  
N-Channel MOSFET  
500V, 4A, 1.5  
Features  
Description  
• R  
= 1.38( Typ.)@ V = 10V, I = 2A  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary, planar  
stripe, DMOS technology.  
DS(on)  
GS  
D
• Low Gate Charge ( Typ. 9nC)  
• Low C ( Typ. 4pF)  
rss  
This advance technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the avalanche  
and commutation mode. These devices are well suited for high  
efficient switching mode power supplies and active power factor  
correction.  
• Fast Switching  
• 100% Avalanche Tested  
• Improved dv/dt Capability  
• ESD Imoroved Capability  
• RoHS Compliant  
D
G
S
D-PAK  
o
MOSFET Maximum Ratings T = 25 C unless otherwise noted*  
C
Symbol  
Parameter  
FDD5N50NZ  
Units  
V
V
Drain to Source Voltage  
Gate to Source Voltage  
500  
V
V
DSS  
GSS  
±25  
o
-Continuous (T = 25 C)  
4
C
I
I
Drain Current  
A
D
o
-Continuous (T = 100 C)  
2.4  
C
Drain Current  
- Pulsed  
ꢀꢀꢀ (Note 1)  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
16  
A
mJ  
A
DM  
E
Single Pulsed Avalanche Energy  
Avalanche Current  
304  
AS  
I
4
AR  
E
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
6.2  
mJ  
V/ns  
W
AR  
dv/dt  
10  
62  
o
(T = 25 C)  
C
P
Power Dissipation  
D
o
o
- Derate above 25 C  
0.5  
W/ C  
o
T , T  
Operating and Storage Temperature Range  
-55 to +150  
C
J
STG  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
o
T
300  
C
L
*Drain current limited by maximum junction temperature  
Thermal Characteristics  
Symbol  
Parameter  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
Units  
FDD5N50NZ  
R
R
2.0  
90  
JC  
o
C/W  
JA  
©2011 Fairchild Semiconductor Corporation  
FDD5N50NZ Rev. C0  
1
www.fairchildsemi.com  

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