PD -5.046
CPV362M4F
IGBT SIP MODULE
Fast IGBT
1
Features
• Fully isolated printed circuit board mount package
• Switching-loss rating includes all "tail" losses
• HEXFREDTM soft ultrafast diodes
• Optimized for medium operating (1 to 10 kHz)
See Fig. 1 for Current vs. Frequency curve
D 1
D 3
D 5
D 6
Q 1
Q 2
Q 3
Q 4
Q 5
Q 6
3
6
9
4
1 5
1 0
1 6
D 2
D 4
1 2
1 8
Product Summary
Output Current in a Typical 5.0 kHz Motor Drive
7
1 3
1 9
11 ARMS per phase (3.1 kW total) with TC = 90°C, TJ = 125°C, Supply Voltage 360Vdc,
Power Factor 0.8, Modulation Depth 115% (See Figure 1)
Description
The IGBT technology is the key to International Rectifier's advanced line of
IMS (Insulated Metal Substrate) Power Modules. These modules are more
efficient than comparable bipolar transistor modules, while at the same time
having the simpler gate-drive requirements of the familiar power MOSFET.
This superior technology has now been coupled to a state of the art materials
system that maximizes power throughput with low thermal resistance. This
package is highly suited to motor drive applications and where space is at a
premium.
IMS-2
Absolute Maximum Ratings
Parameter
Collector-to-Emitter Voltage
Max.
600
Units
V
VCES
IC @ TC = 25°C
Continuous Collector Current, each IGBT
Continuous Collector Current, each IGBT
Pulsed Collector Current
8.8
IC @ TC = 100°C
4.8
ICM
26
A
ILM
Clamped Inductive Load Current
Diode Continuous Forward Current
Diode Maximum Forward Current
Gate-to-Emitter Voltage
26
IF @ TC = 100°C
3.4
IFM
26
VGE
±20
V
VRMS
W
VISOL
Isolation Voltage, any terminal to case, 1 minute
Maximum Power Dissipation, each IGBT
Maximum Power Dissipation, each IGBT
Operating Junction and
2500
23
PD @ TC = 25°C
PD @ TC = 100°C
9.1
TJ
-40 to +150
TSTG
Storage Temperature Range
°C
Soldering Temperature, for 10 sec.
Mounting torque, 6-32 or M3 screw
300 (0.063 in. (1.6mm) from case)
5-7 lbf•in (0.55-0.8 N•m)
Thermal Resistance
Parameter
Typ.
–––
Max.
5.5
9.0
Units
°C/W
R
R
R
θJC(IGBT)
Junction-to-Case, each IGBT, one IGBT in conduction
Junction-to-Case, each diode, one diode in conduction
Case-to-Sink, flat, greased surface
θJC(DIODE)
θCS(MODULE)
–––
0.1
–––
–––
Wt
Weight of module
20 (0.7)
g (oz)
9/16/97