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CPV363MF

更新时间: 2024-10-29 22:28:43
品牌 Logo 应用领域
英飞凌 - INFINEON 双极性晶体管
页数 文件大小 规格书
8页 421K
描述
IGBT SIP MODULE Fast IGBT

CPV363MF 数据手册

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Previous Datasheet  
Index  
Next Data Sheet  
PD - 5.023B  
CPV363MF  
IGBT SIP MODULE  
Fast IGBT  
1
Features  
• Fully isolated printed circuit board mount package  
• Switching-loss rating includes all "tail" losses  
• HEXFREDTM soft ultrafast diodes  
• Optimized for medium operating frequency (1 to  
10kHz) See Fig. 1 for Current vs. Frequency curve  
D1  
D2  
D3  
D4  
D5  
D6  
Q1  
Q2  
Q3  
Q4  
Q5  
3
6
9
4
15  
10  
16  
Q6  
12  
18  
Product Summary  
7
13  
19  
Output Current in a Typical 5.0 kHz Motor Drive  
7.65 ARMS per phase (2.4 kW total) with TC = 90°C, TJ = 125°C, Supply Voltage 360Vdc,  
Power Factor 0.8, Modulation Depth 80% (See Figure 1)  
Description  
The IGBT technology is the key to International Rectifier's advanced line of  
IMS (Insulated Metal Substrate) Power Modules. These modules are more  
efficient than comparable bipolar transistor modules, while at the same time  
having the simpler gate-drive requirements of the familiar power MOSFET.  
This superior technology has now been coupled to a state of the art materials  
system that maximizes power throughput with low thermal resistance. This  
package is highly suited to motor drive applications and where space is at a  
premium.  
IMS-2  
Absolute Maximum Ratings  
Parameter  
Collector-to-Emitter Voltage  
Max.  
600  
16  
Units  
V
VCES  
IC @ TC = 25°C  
Continuous Collector Current, each IGBT  
Continuous Collector Current, each IGBT  
Pulsed Collector Current  
IC @ TC = 100°C  
8.7  
ICM  
50  
A
ILM  
Clamped Inductive Load Current  
Diode Continuous Forward Current  
Diode Maximum Forward Current  
Gate-to-Emitter Voltage  
50  
IF @ TC = 100°C  
6.1  
IFM  
50  
VGE  
±20  
V
VRMS  
W
VISOL  
Isolation Voltage, any terminal to case, 1 min.  
Maximum Power Dissipation, each IGBT  
2500  
36  
PD @ TC = 25°C  
PD @ TC = 100°C Maximum Power Dissipation, each IGBT  
14  
TJ  
Operating Junction and  
-40 to +150  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 sec.  
Mounting torque, 6-32 or M3 screw.  
°C  
300 (0.063 in. (1.6mm) from case)  
5-7 lbf•in (0.55-0.8 N•m)  
Thermal Resistance  
Parameter  
Typ.  
Max.  
Units  
R
R
R
θJC (IGBT)  
Junction-to-Case, each IGBT, one IGBT in conduction  
Junction-to-Case, each diode, one diode in conduction  
Case-to-Sink, flat, greased surface  
3.5  
5.5  
θJC (DIODE)  
θCS (MODULE)  
°C/W  
0.1  
Wt  
Weight of module  
20 (0.7)  
g (oz)  
Revision 1  
C-149  
To Order  
 
 

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