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CPV363M4KPBF

更新时间: 2024-10-30 12:27:03
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率控制双极性晶体管局域网超快软恢复二极管快速软恢复二极管
页数 文件大小 规格书
11页 279K
描述
IGBT SIP Module (Short Circuit Rated Ultrafast IGBT)

CPV363M4KPBF 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Obsolete包装说明:ROHS COMPLIANT, IMS-2, SIP-13
针数:13Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.1
Is Samacsys:N其他特性:ULTRA FAST SOFT RECOVERY
外壳连接:ISOLATED最大集电极电流 (IC):11 A
集电极-发射极最大电压:600 V配置:COMPLEX
门极-发射极最大电压:20 VJESD-30 代码:R-XSFM-T13
元件数量:6端子数量:13
最高工作温度:150 °C封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):36 W认证状态:Not Qualified
子类别:Insulated Gate BIP Transistors表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:POWER CONTROL
晶体管元件材料:SILICON标称断开时间 (toff):405 ns
标称接通时间 (ton):78 nsVCEsat-Max:2.1 V
Base Number Matches:1

CPV363M4KPBF 数据手册

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CPV363M4KPbF  
Vishay High Power Products  
IGBT SIP Module  
(Short Circuit Rated Ultrafast IGBT)  
FEATURES  
• Short circuit rated ultrafast: Optimized for high  
speed over 5.0 kHz (see fig. 1 for current vs.  
frequency curve), and short circuit rated to 10 µs  
at 125 °C, VGE = 15 V  
RoHS  
COMPLIANT  
• Fully isolated printed circuit board mount package  
• Switching-loss rating includes all “tail” losses  
• HEXFRED® soft ultrafast diodes  
IMS-2  
• Totally lead (Pb)-free  
PRODUCT SUMMARY  
• Designed and qualified for industrial level  
OUTPUT CURRENT IN A TYPICAL 20 kHz MOTOR DRIVE  
DESCRIPTION  
IRMS per phase (1.94 kW total)  
6.7 ARMS  
with TC = 90 °C  
The IGBT technology is the key to Vishay’s HPP advanced  
line of IMS (Insulated Metal Substrate) power modules.  
These modules are more efficient than comparable bipolar  
transistor modules, while at the same time having the simpler  
gate-drive requirements of the familiar power MOSFET. This  
superior technology has now been coupled to a state of the  
art materials system that maximizes power throughput with  
low thermal resistance. This package is highly suited to  
motor drive applications and where space is at a premium.  
TJ  
125 °C  
360 Vdc  
0.8  
Supply voltage  
Power factor  
Modulation depth (see fig. 1)  
115 %  
V
CE(on) (typical)  
at IC = 6.0 A, 25 °C  
1.72 V  
ABSOLUTE MAXIMUM RATINGS  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MAX.  
600  
11  
UNITS  
Collector to emitter voltage  
VCES  
V
TC = 25 °C  
C = 100 °C  
Continuous collector current, each IGBT  
Pulsed collector current  
IC  
A
A
T
6.0  
Repetitive rating; VGE = 20 V, pulse width  
limited by maximum junction temperature  
See fig. 20  
ICM  
22  
22  
VCC = 80 % (VCES), VGE = 20 V,  
L = 10 µH, RG = 22 Ω  
See fig. 19  
Clamped inductive load current  
ILM  
A
Diode continuous forward current  
Diode maximum forward current  
Short circuit withstand time  
Gate to emitter voltage  
IF  
IFM  
TC = 100 °C  
6.1  
22  
A
A
tSC  
10  
µs  
VGE  
VISOL  
20  
V
Isolation voltage  
Any terminal to case, t = 1 minute  
TC = 25 °C  
2500  
36  
VRMS  
Maximum power dissipation, each IGBT  
PD  
W
TC = 100 °C  
14  
Operating junction and  
storage temperature range  
TJ, TStg  
- 40 to + 150  
300  
°C  
Soldering temperature  
For 10 s, (0.063" (1.6 mm) from case)  
6-32 or M3 screw  
5 to 7  
(0.55 to 0.8)  
lbf in  
(N m)  
Mounting torque  
Document Number: 94485  
Revision: 01-Sep-08  
For technical questions, contact: ind-modules@vishay.com  
www.vishay.com  
1

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