AUIRFS8408-7P
AUTOMOTIVE GRADE
HEXFET® Power MOSFET
Features
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Advanced Process Technology
40V
VDSS
New Ultra Low On-Resistance
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free, RoHS Compliant
Automotive Qualified *
0.70m
RDS(on) typ.
Ω
max.
ID (Silicon Limited)
ID (Package Limited)
1.0m
397A
240A
Ω
Description
Specifically designed for Automotive applications, this HEXFET®
PowerMOSFETutilizesthelatestprocessingtechniquestoachieve
extremely low on-resistance per silicon area. Additional features
of this design are a 175°C junction operating temperature, fast
switching speed and improved repetitive avalanche rating. These
features combine to make this product an extremely efficient and
reliable device for use in Automotive and wide variety of other
applications.
D
S
D
S
S
G
S
S
S
G
D2Pak 7 Pin
Applications
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Electric Power Steering (EPS)
Battery Switch
Start/Stop Micro Hybrid
Heavy Loads
SMPS
G
Gate
D
Drain
S
Source
Ordering Information
Base part number
Package Type
Standard Pack
Form
Complete Part Number
Quantity
D2Pak 7 Pin
AUIRFS8408-7P
Tube
50
AUIRFS8408-7P
Tape and Reel Left
Tape and Reel Right
800
800
AUIRFS8408-7TRL
AUIRFS8408-7TRR
Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only; and
functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under
board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.
Symbol
ID @ TC = 25°C
Parameter
Max.
397
Units
Continuous Drain Current, VGS @ 10V (Silicon Limited)
ID @ TC = 100°C
ID @ TC = 25°C
IDM
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Package Limited)
Pulsed Drain Current
280
240
A
1300
PD @TC = 25°C
W
294
Maximum Power Dissipation
1.96
± 20
Linear Derating Factor
Gate-to-Source Voltage
W/°C
V
VGS
TJ
-55 to + 175
Operating Junction and
TSTG
°C
Storage Temperature Range
300
Soldering Temperature, for 10 seconds (1.6mm from case)
Avalanche Characteristics
Single Pulse Avalanche Energy
EAS (Thermally limited)
501
809
mJ
EAS (tested)
IAR
Single Pulse Avalanche Energy Tested Value
Avalanche Current
See Fig. 14, 15, 24a, 24b
A
Repetitive Avalanche Energy
EAR
mJ
Thermal Resistance
Symbol
Parameter
Typ.
Max.
0.51
40
Units
°C/W
RqJC
RqJA
–––
Junction-to-Case
–––
Junction-to-Ambient (PCB Mount)
HEXFET® is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
1
www.irf.com
© 2013 International Rectifier
April 25 ,2013