PD - 96401A
AUTOMOTIVE GRADE
AUIRFS3206
AUIRFSL3206
Features
HEXFET® Power MOSFET
Advanced Process Technology
Ultra Low On-Resistance
D
S
V(BR)DSS
RDS(on) typ.
max.
60V
2.4m
3.0m
210A
Enhanced dV/dT and dI/dT capability
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free, RoHS Compliant
Automotive Qualified *
G
ID
(Silicon Limited)
ID (Package Limited)
120A
Description
Specifically designed for Automotive applications, this
HEXFET® Power MOSFET utilizes the latest processing
techniquestoachieveextremelylowon-resistancepersilicon
area. Additional features of this design are a 175°C junction
operating temperature, fast switching speed and improved
repetitiveavalancherating. Thesefeaturescombinetomake
this design an extremely efficient and reliable device for use
in Automotive applications and a wide variety of other
D
D
S
D
S
D
G
G
D2Pak
TO-262
AUIRFSL3206
AUIRFS3206
applications.
G
D
S
Gate
Drain
Source
Absolute Maximum Ratings
StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestress
ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications
is not implied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. Thethermal
resistanceandpowerdissipationratingsaremeasuredunderboardmountedandstillairconditions.Ambienttemperature(TA)
is 25°C, unless otherwise specified.
Max.
Parameter
Units
ID @ TC = 25°C
ID @ TC = 100°C
ID @ TC = 25°C
IDM
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Package Limited)
210
150
A
120
840
Pulsed Drain Current
PD @TC = 25°C
300
Maximum Power Dissipation
Linear Derating Factor
W
W/°C
V
2.0
VGS
± 20
170
Gate-to-Source Voltage
EAS (Thermally limited)
Single Pulse Avalanche Energy
Avalanche Current
mJ
A
IAR
See Fig. 14, 15, 22a, 22b,
EAR
dv/dt
TJ
Repetitive Avalanche Energy
Peak Diode Recovery
mJ
V/ns
5.0
-55 to + 175
Operating Junction and
TSTG
°C
Storage Temperature Range
Soldering Temperature, for 10 seconds (1.6mm from case)
300
Thermal Resistance
Parameter
Junction-to-Case
Junction-to-Ambient (PCB Mount) , D2Pak
Typ.
–––
Max.
0.50
40
Units
°C/W
Rθ
JC
RθJA
–––
HEXFET® is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
www.irf.com
1
09/06/11