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AUIRFSL3206 PDF预览

AUIRFSL3206

更新时间: 2024-11-26 12:53:03
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
13页 292K
描述
Advanced Process Technology Ultra Low On-Resistance

AUIRFSL3206 数据手册

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PD - 96401A  
AUTOMOTIVE GRADE  
AUIRFS3206  
AUIRFSL3206  
Features  
HEXFET® Power MOSFET  
Advanced Process Technology  
Ultra Low On-Resistance  
D
S
V(BR)DSS  
RDS(on) typ.  
max.  
60V  
2.4m  
3.0m  
210A  
Enhanced dV/dT and dI/dT capability  
175°C Operating Temperature  
Fast Switching  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free, RoHS Compliant  
Automotive Qualified *  
G
ID  
(Silicon Limited)  
ID (Package Limited)  
120A  
Description  
Specifically designed for Automotive applications, this  
HEXFET® Power MOSFET utilizes the latest processing  
techniquestoachieveextremelylowon-resistancepersilicon  
area. Additional features of this design are a 175°C junction  
operating temperature, fast switching speed and improved  
repetitiveavalancherating. Thesefeaturescombinetomake  
this design an extremely efficient and reliable device for use  
in Automotive applications and a wide variety of other  
D
D
S
D
S
D
G
G
D2Pak  
TO-262  
AUIRFSL3206  
AUIRFS3206  
applications.  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Stressesbeyondthoselistedunder“AbsoluteMaximumRatings”maycausepermanentdamagetothedevice.Thesearestress  
ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications  
is not implied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. Thethermal  
resistanceandpowerdissipationratingsaremeasuredunderboardmountedandstillairconditions.Ambienttemperature(TA)  
is 25°C, unless otherwise specified.  
Max.  
Parameter  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
ID @ TC = 25°C  
IDM  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Package Limited)  
210  
150  
A
120  
840  
Pulsed Drain Current  
PD @TC = 25°C  
300  
Maximum Power Dissipation  
Linear Derating Factor  
W
W/°C  
V
2.0  
VGS  
± 20  
170  
Gate-to-Source Voltage  
EAS (Thermally limited)  
Single Pulse Avalanche Energy  
Avalanche Current  
mJ  
A
IAR  
See Fig. 14, 15, 22a, 22b,  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery  
mJ  
V/ns  
5.0  
-55 to + 175  
Operating Junction and  
TSTG  
°C  
Storage Temperature Range  
Soldering Temperature, for 10 seconds (1.6mm from case)  
300  
Thermal Resistance  
Parameter  
Junction-to-Case  
Junction-to-Ambient (PCB Mount) , D2Pak  
Typ.  
–––  
Max.  
0.50  
40  
Units  
°C/W  
Rθ  
JC  
RθJA  
–––  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
09/06/11  

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