AUTOMOTIVE GRADE
AUIRFS6535
AUIRFSL6535
Features
HEXFET® Power MOSFET
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Advanced Process Technology
D
LowOn-Resistance
175°COperatingTemperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free,RoHSCompliant
Automotive Qualified *
V(BR)DSS
300V
RDS(on) typ.
148m
185m
19A
G
max.
S
ID
Description
D
SpecificallydesignedforAutomotiveapplications,
this HEXFET® Power MOSFET utilizes the latest
processing techniques to achieve extremely low
on-resistancepersiliconarea. Additionalfeatures
of this design are a 175°C junction operating
temperature, fast switching speed and improved
repetitiveavalancherating. Thesefeaturescom-
bine to make this design an extremely efficient
andreliabledeviceforuseinAutomotiveapplica-
tions and a wide variety of other applications.
D
S
D
S
D
G
G
D2Pak
AUIRFS6535
TO-262
AUIRFSL6535
G
D
Drain
S
Gate
Source
Base part
number
Package Type
Standard Pack
Orderable Part Number
Form
Tube
Tube
Quantity
50
AUIRFSL6535
AUIRFS6535
TO-262
D2Pak
AUIRFSL6535
AUIRFS6535
50
Tape and Reel Left
Tape and Reel Right
800
800
AUIRFS6535TRL
AUIRFS6535TRR
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in
the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.
Ambient temperature (TA) is 25°C, unless otherwise specified.
Parameter
Max.
19
Units
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V
13
A
Pulsed Drain Current
IDM
100
PD @TC = 25°C
Power Dissipation
210
1.4
W
W/°C
V
Linear Derating Factor
VGS
EAS
Gate-to-Source Voltage
± 20
Single Pulse Avalanche Energy (Thermally Limited)
216
310
mJ
Single Pulse Avalanche Energy Tested Value
Avalanche Current
EAS (tested )
IAR
See Fig.12a, 12b, 15, 16
A
Repetitive Avalanche Energy
EAR
TJ
mJ
Operating Junction and
-55 to + 175
300
TSTG
Storage Temperature Range
°C
Soldering Temperature, for 10 seconds (1.6mm from case )
Thermal Resistance
Parameter
Typ.
–––
Max.
0.71
40
Units
R
R
Junction-to-Case
Junction-to-Ambient (PCB Mount)
°C/W
JC
JA
–––
HEXFET® is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
www.irf.com © 2012 International Rectifier
July 23, 2012
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