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APTM100DU18TG PDF预览

APTM100DU18TG

更新时间: 2024-11-24 04:06:39
品牌 Logo 应用领域
美高森美 - MICROSEMI 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
6页 291K
描述
Dual Common Source MOSFET Power Module

APTM100DU18TG 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:FLANGE MOUNT, R-XUFM-X12针数:12
Reach Compliance Code:unknown风险等级:5.6
Is Samacsys:N其他特性:AVALANCHE RATED
雪崩能效等级(Eas):3000 mJ外壳连接:ISOLATED
配置:COMMON SOURCE, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR最小漏源击穿电压:1000 V
最大漏极电流 (Abs) (ID):43 A最大漏极电流 (ID):43 A
最大漏源导通电阻:0.21 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-XUFM-X12JESD-609代码:e1
湿度敏感等级:1元件数量:2
端子数量:12工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):780 W最大脉冲漏极电流 (IDM):172 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:TIN SILVER COPPER
端子形式:UNSPECIFIED端子位置:UPPER
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

APTM100DU18TG 数据手册

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APTM100DU18TG  
VDSS = 1000V  
Dual Common Source  
RDSon = 180mtyp @ Tj = 25°C  
MOSFET Power Module  
ID = 43A @ Tc = 25°C  
Application  
D1  
D2  
AC Switches  
Q1  
Q2  
Switched Mode Power Supplies  
Uninterruptible Power Supplies  
G1  
G2  
Features  
Power MOS 7® MOSFETs  
S1  
-
-
-
-
-
Low RDSon  
S2  
Low input and Miller capacitance  
Low gate charge  
S
NTC1  
NTC2  
Avalanche energy rated  
Very rugged  
Kelvin source for easy drive  
Very low stray inductance  
-
-
Symmetrical design  
Lead frames for power connections  
Internal thermistor for temperature monitoring  
High level of integration  
Benefits  
G2  
S2  
D2  
D2  
Outstanding performance at high frequency operation  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Solderable terminals both for power and signal for  
easy PCB mounting  
D1  
S
S1  
G1  
S2  
G2  
NTC2  
NTC1  
Low profile  
RoHS Compliant  
Absolute maximum ratings  
Symbol  
Parameter  
Max ratings  
Unit  
VDSS  
Drain - Source Breakdown Voltage  
1000  
V
Tc = 25°C  
43  
33  
172  
±30  
210  
780  
ID  
Continuous Drain Current  
A
Tc = 80°C  
IDM  
VGS  
RDSon  
PD  
Pulsed Drain current  
Gate - Source Voltage  
V
m  
W
Drain - Source ON Resistance  
Maximum Power Dissipation  
Tc = 25°C  
IAR  
EAR  
EAS  
Avalanche current (repetitive and non repetitive)  
25  
A
Repetitive Avalanche Energy  
50  
mJ  
Single Pulse Avalanche Energy  
3000  
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note  
APT0502 on www.microsemi.com  
www.microsemi.com  
1 – 6  

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