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APTM100H35FTG PDF预览

APTM100H35FTG

更新时间: 2024-11-24 04:06:43
品牌 Logo 应用领域
美高森美 - MICROSEMI 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
6页 294K
描述
Full - Bridge MOSFET Power Module

APTM100H35FTG 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:FLANGE MOUNT, R-XUFM-X14
针数:14Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.22
Is Samacsys:N其他特性:AVALANCHE RATED
雪崩能效等级(Eas):3000 mJ外壳连接:ISOLATED
配置:BRIDGE, 4 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR最小漏源击穿电压:1000 V
最大漏极电流 (ID):22 A最大漏源导通电阻:0.42 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-XUFM-X14
JESD-609代码:e1湿度敏感等级:1
元件数量:4端子数量:14
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):88 A
认证状态:Not Qualified表面贴装:NO
端子面层:TIN SILVER COPPER端子形式:UNSPECIFIED
端子位置:UPPER处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

APTM100H35FTG 数据手册

 浏览型号APTM100H35FTG的Datasheet PDF文件第2页浏览型号APTM100H35FTG的Datasheet PDF文件第3页浏览型号APTM100H35FTG的Datasheet PDF文件第4页浏览型号APTM100H35FTG的Datasheet PDF文件第5页浏览型号APTM100H35FTG的Datasheet PDF文件第6页 
APTM100H35FTG  
VDSS = 1000V  
Full - Bridge  
RDSon = 350mtyp @ Tj = 25°C  
MOSFET Power Module  
ID = 22A @ Tc = 25°C  
Application  
VBUS  
Welding converters  
Q1  
Q3  
Switched Mode Power Supplies  
Uninterruptible Power Supplies  
Motor control  
G3  
S3  
G1  
S1  
OUT1  
OUT2  
Features  
Power MOS 7® FREDFETs  
Q2  
Q4  
-
-
-
-
-
-
Low RDSon  
Low input and Miller capacitance  
Low gate charge  
G4  
S4  
G2  
S2  
Fast intrinsic reverse diode  
Avalanche energy rated  
Very rugged  
NT C1  
0/VBUS  
NTC2  
Kelvin source for easy drive  
Very low stray inductance  
-
-
Symmetrical design  
Lead frames for power connections  
Internal thermistor for temperature monitoring  
High level of integration  
G3  
S3  
G4  
S4  
OUT2  
OUT1  
Benefits  
Outstanding performance at high frequency operation  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Solderable terminals both for power and signal for  
easy PCB mounting  
VBUS  
0/VBUS  
S1  
G1  
S2  
G2  
NTC2  
NTC1  
Low profile  
RoHS Compliant  
Absolute maximum ratings  
Symbol  
Parameter  
Max ratings  
Unit  
VDSS  
Drain - Source Breakdown Voltage  
1000  
V
Tc = 25°C  
22  
ID  
Continuous Drain Current  
A
Tc = 80°C  
17  
IDM  
VGS  
RDSon  
Pulsed Drain current  
Gate - Source Voltage  
Drain - Source ON Resistance  
88  
±30  
420  
390  
V
m  
W
PD  
IAR  
EAR  
EAS  
Maximum Power Dissipation  
Tc = 25°C  
Avalanche current (repetitive and non repetitive)  
25  
50  
3000  
A
Repetitive Avalanche Energy  
mJ  
Single Pulse Avalanche Energy  
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note  
APT0502 on www.microsemi.com  
www.microsemi.com  
1 – 6  

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