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APTM100SK33T1G PDF预览

APTM100SK33T1G

更新时间: 2024-11-05 08:33:43
品牌 Logo 应用领域
美高森美 - MICROSEMI 晶体晶体管功率场效应晶体管开关脉冲斩波器局域网
页数 文件大小 规格书
5页 146K
描述
Buck chopper MOSFET Power Module

APTM100SK33T1G 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active包装说明:FLANGE MOUNT, R-XUFM-X12
针数:12Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.76
Is Samacsys:N其他特性:AVALANCHE RATED
外壳连接:ISOLATED配置:SINGLE WITH BUILT-IN DIODE AND THERMISTOR
最小漏源击穿电压:1000 V最大漏极电流 (Abs) (ID):23 A
最大漏极电流 (ID):23 A最大漏源导通电阻:0.396 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-XUFM-X12
JESD-609代码:e1湿度敏感等级:1
元件数量:1端子数量:12
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):390 W
最大脉冲漏极电流 (IDM):140 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:TIN SILVER COPPER端子形式:UNSPECIFIED
端子位置:UPPER处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

APTM100SK33T1G 数据手册

 浏览型号APTM100SK33T1G的Datasheet PDF文件第2页浏览型号APTM100SK33T1G的Datasheet PDF文件第3页浏览型号APTM100SK33T1G的Datasheet PDF文件第4页浏览型号APTM100SK33T1G的Datasheet PDF文件第5页 
APTM100SK33T1G  
VDSS = 1000V  
Buck chopper  
MOSFET Power Module  
R
DSon = 330mΩ typ @ Tj = 25°C  
ID = 23A @ Tc = 25°C  
11  
5
6
Application  
AC and DC motor control  
Switched Mode Power Supplies  
Q1  
7
8
Features  
NTC  
3
4
Power MOS 8™ MOSFETs  
-
-
-
-
-
Low RDSon  
Low input and Miller capacitance  
Low gate charge  
Avalanche energy rated  
Very rugged  
CR2  
1
Very low stray inductance  
Internal thermistor for temperature monitoring  
High level of integration  
12  
2
Benefits  
Outstanding performance at high frequency operation  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Solderable terminals both for power and signal for  
easy PCB mounting  
Low profile  
RoHS Compliant  
Pins 1/2 ; 3/4 ; 5/6 must be shorted together  
Absolute maximum ratings  
Symbol  
Parameter  
Max ratings  
Unit  
VDSS  
Drain - Source Breakdown Voltage  
1000  
23  
17  
V
Tc = 25°C  
Tc = 80°C  
ID  
Continuous Drain Current  
A
IDM  
VGS  
RDSon  
Pulsed Drain current  
Gate - Source Voltage  
Drain - Source ON Resistance  
140  
±30  
396  
V
mΩ  
W
PD  
Maximum Power Dissipation  
Tc = 25°C  
390  
18  
IAR  
Avalanche current (repetitive and non repetitive)  
A
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note  
APT0502 on www.microsemi.com  
1 – 5  
www.microsemi.com  

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