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APTM100UM65DAG PDF预览

APTM100UM65DAG

更新时间: 2024-11-24 04:32:51
品牌 Logo 应用领域
美高森美 - MICROSEMI 晶体二极管开关晶体管功率场效应晶体管脉冲局域网
页数 文件大小 规格书
6页 277K
描述
Single switch with Series diode MOSFET Power Module

APTM100UM65DAG 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:FLANGE MOUNT, R-PUFM-X2
针数:2Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.69
Is Samacsys:N其他特性:AVALANCHE RATED
雪崩能效等级(Eas):3200 mJ外壳连接:ISOLATED
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:1000 V
最大漏极电流 (ID):145 A最大漏源导通电阻:0.078 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PUFM-X2
JESD-609代码:e1湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):580 A
认证状态:Not Qualified表面贴装:NO
端子面层:TIN SILVER COPPER端子形式:UNSPECIFIED
端子位置:UPPER处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

APTM100UM65DAG 数据手册

 浏览型号APTM100UM65DAG的Datasheet PDF文件第2页浏览型号APTM100UM65DAG的Datasheet PDF文件第3页浏览型号APTM100UM65DAG的Datasheet PDF文件第4页浏览型号APTM100UM65DAG的Datasheet PDF文件第5页浏览型号APTM100UM65DAG的Datasheet PDF文件第6页 
APTM100UM65DAG  
VDSS = 1000V  
Single switch  
with Series diode  
RDSon = 65mtyp @ Tj = 25°C  
ID = 145A @ Tc = 25°C  
MOSFET Power Module  
SK  
Application  
Zero Current Switching resonant mode  
S
D
Features  
Power MOS 7® MOSFETs  
-
-
-
-
-
Low RDSon  
G
DK  
Low input and Miller capacitance  
Low gate charge  
Avalanche energy rated  
Very rugged  
Kelvin source for easy drive  
Very low stray inductance  
-
-
Symmetrical design  
M5 power connectors  
High level of integration  
AlN substrate for improved thermal performance  
S
D
DK  
Benefits  
Outstanding performance at high frequency  
operation  
SK  
G
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Low profile  
RoHS Compliant  
Absolute maximum ratings  
Symbol  
Parameter  
Max ratings  
1000  
145  
Unit  
VDSS  
Drain - Source Breakdown Voltage  
V
Tc = 25°C  
ID  
Continuous Drain Current  
A
Tc = 80°C  
110  
IDM  
VGS  
RDSon  
Pulsed Drain current  
Gate - Source Voltage  
Drain - Source ON Resistance  
580  
±30  
V
m  
W
78  
PD  
IAR  
EAR  
EAS  
Maximum Power Dissipation  
Tc = 25°C  
3250  
30  
50  
3200  
Avalanche current (repetitive and non repetitive)  
A
Repetitive Avalanche Energy  
mJ  
Single Pulse Avalanche Energy  
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note  
APT0502 on www.microsemi.com  
www.microsemi.com  
1 – 6  

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