是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 包装说明: | FLANGE MOUNT, R-XUFM-P25 |
针数: | 25 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | 风险等级: | 5.22 |
Is Samacsys: | N | 其他特性: | AVALANCHE RATED |
雪崩能效等级(Eas): | 3000 mJ | 外壳连接: | ISOLATED |
配置: | COMPLEX | 最小漏源击穿电压: | 1000 V |
最大漏极电流 (ID): | 22 A | 最大漏源导通电阻: | 0.42 Ω |
FET 技术: | METAL-OXIDE SEMICONDUCTOR | JESD-30 代码: | R-XUFM-P25 |
JESD-609代码: | e1 | 湿度敏感等级: | 1 |
元件数量: | 4 | 端子数量: | 25 |
工作模式: | ENHANCEMENT MODE | 最高工作温度: | 150 °C |
封装主体材料: | UNSPECIFIED | 封装形状: | RECTANGULAR |
封装形式: | FLANGE MOUNT | 峰值回流温度(摄氏度): | NOT SPECIFIED |
极性/信道类型: | N-CHANNEL | 最大脉冲漏极电流 (IDM): | 88 A |
认证状态: | Not Qualified | 表面贴装: | NO |
端子面层: | TIN SILVER COPPER | 端子形式: | PIN/PEG |
端子位置: | UPPER | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
晶体管应用: | SWITCHING | 晶体管元件材料: | SILICON |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
APTM100H35FT3G-Module | MICROCHIP |
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FREDFETsLow RDSonLow input and Miller capacitanceLow gate chargeFast intrinsic reverse dio | |
APTM100H35FTG | MICROSEMI |
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Full - Bridge MOSFET Power Module | |
APTM100H35FTG-Module | MICROCHIP |
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FREDFETsLow RDSonLow input and Miller capacitanceLow gate chargeFast intrinsic reverse dio | |
APTM100H40FT3G | MICROSEMI |
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Full - Bridge MOSFET Power Module | |
APTM100H45FT3 | ADPOW |
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Full - Bridge MOSFET Power Module | |
APTM100H45FT3G | MICROSEMI |
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Full - Bridge MOSFET Power Module | |
APTM100H45FT3G-Module | MICROCHIP |
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FREDFETsLow RDSonLow input and Miller capacitanceLow gate chargeFast intrinsic reverse dio | |
APTM100H45SCT | ADPOW |
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Full bridge Series & SiC parallel diodes MOSFET Power Module | |
APTM100H45SCTG | MICROSEMI |
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Full bridge Series & SiC parallel diodes MOSFET Power Module | |
APTM100H45SCTG-Module | MICROCHIP |
获取价格 |
MOSFETsLow RDSonLow input and Miller capacitanceLow gate chargeAvalanche energy ratedVery |