Datasheet > APTGT150TA60PG-Module

APTGT150TA60PG-Module

更新时间： 2024-11-08 14:55:47

品牌	Logo	应用领域
美国微芯 - MICROCHIP		双极性晶体管
页数	文件大小	规格书
6页	520K
描述
Configuration: Triple Phase legVCES (V): 600VCESat (V): 1.5Current (A) Tc=80C: 150Silicon type: TRENCH 3 IGBT Package: SP6P

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APTGT150TA60PG

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The information contained in the document (unless it is publicly available on the Web without access restrictions) is

PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted,

transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. If the

recipient of this document has entered into a disclosure agreement with Microsemi, then the terms of such Agreement

will also apply. This document and the information contained herein may not be modified, by any person other than

authorized personnel of Microsemi. No license under any patent, copyright, trade secret or other intellectual property

right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication,

inducement, estoppels or otherwise. Any license under such intellectual property rights must be approved by

Microsemi in writing signed by an officer of Microsemi.

Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime

without any notice. This product has been subject to limited testing and should not be used in conjunction with life-

support or other mission-critical equipment or applications. Microsemi assumes no liability whatsoever, and Microsemi

disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or

warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other

intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or

user must conduct and complete all performance and other testing of this product as well as any user or customers final

application. User or customer shall not rely on any data and performance specifications or parameters provided by

Microsemi. It is the customer’s and user’s responsibility to independently determine suitability of any Microsemi

product and to test and verify the same. The information contained herein is provided “AS IS, WHERE IS” and with all

faults, and the entire risk associated with such information is entirely with the User. Microsemi specifically disclaims

any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. The product

is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp

Life Support Application

Seller's Products are not designed, intended, or authorized for use as components in systems intended for space,

aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other

application in which the failure of the Seller's Product could create a situation where personal injury, death or property

damage or loss may occur (collectively "Life Support Applications").

Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive

testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees,

subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and

expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage

or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations

that Seller was negligent regarding the design or manufacture of the goods.

Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with

Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the

new proposed specific part.

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与APTGT150TA60PG-Module相关器件

型号	品牌	获取价格	描述	数据表
APTGT150TDU60P	ADPOW	获取价格	Triple Dual Common Source Trench + Field Stop IGBT Power Module
APTGT150TDU60PG	MICROSEMI	获取价格	Triple Dual Common Source Trench + Field Stop IGBT Power Module
APTGT150TDU60PG-Module	MICROCHIP	获取价格	Configuration: Triple Dual common sourceVCES (V): 600VCESat (V): 1.5Current (A) Tc=80C: 15
APTGT150TL60G	MICROSEMI	获取价格	Three level inverter Trench + Field Stop IGBT Power Module
APTGT150TL60G-Module	MICROCHIP	获取价格	Configuration: Three level inverterVCES (V): 600VCESat (V): 1.5Current (A) Tc=80C: 150Sili
APTGT150X120E3G	ADPOW	获取价格	3 Phase bridge Trench + Field Stop IGBT Power Module
APTGT200A120	ADPOW	获取价格	Phase leg Fast Trench + Field Stop IGBT Power Module
APTGT200A120D3	ADPOW	获取价格	Phase leg Trench IGBT Power Module
APTGT200A120D3G	MICROSEMI	获取价格	Phase leg Trench + Field Stop IGBT Power Module
APTGT200A120D3G-Module	MICROCHIP	获取价格	Configuration: Phase legVCES (V): 1200VCESat (V): 1.7Current (A) Tc=80C: 200Silicon type:

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