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TTC0002

更新时间: 2024-10-30 06:02:11
品牌 Logo 应用领域
东芝 - TOSHIBA 晶体晶体管功率双极晶体管放大器局域网
页数 文件大小 规格书
5页 188K
描述
Transistor Silicon NPN Triple Diffused Type

TTC0002 技术参数

生命周期:Active包装说明:2-21F1A, 3 PIN
针数:3Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.74
Is Samacsys:N外壳连接:COLLECTOR
最大集电极电流 (IC):18 A集电极-发射极最大电压:160 V
配置:SINGLE最小直流电流增益 (hFE):35
JESD-30 代码:R-PSFM-T3元件数量:1
端子数量:3最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT极性/信道类型:NPN
认证状态:Not Qualified表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
晶体管应用:AMPLIFIER晶体管元件材料:SILICON
标称过渡频率 (fT):30 MHzBase Number Matches:1

TTC0002 数据手册

 浏览型号TTC0002的Datasheet PDF文件第2页浏览型号TTC0002的Datasheet PDF文件第3页浏览型号TTC0002的Datasheet PDF文件第4页浏览型号TTC0002的Datasheet PDF文件第5页 
TTC0002  
TOSHIBA Transistor Silicon NPN Triple Diffused Type  
TTC0002  
Power Amplifier Applications  
Unit: mm  
High collector voltage: V  
= 160 V (min)  
CEO  
Complementary to TTA0002  
Recommended for 100-W high-fidelity audio frequency amplifier output  
stage.  
Absolute Maximum Ratings (Tc = 25°C)  
Characteristics  
Collector-base voltage  
Symbol  
Rating  
Unit  
V
CBO  
V
CEO  
V
EBO  
160  
V
V
Collector-emitter voltage  
Emitter-base voltage  
160  
5
V
DC  
I
18  
A
C
Collector current  
Pulse  
I
35  
9
A
CP  
JEDEC  
JEITA  
Base current  
I
A
B
Collector power dissipation  
Junction temperature  
Storage temperature range  
P
180  
W
°C  
°C  
C
東 芝  
2-21F1A  
T
150  
j
T
stg  
55 to 150  
Weight: 9.75 g (typ.)  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report  
and estimated failure rate, etc).  
1
2009-06-11  

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