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TTC007 PDF预览

TTC007

更新时间: 2024-10-30 08:32:51
品牌 Logo 应用领域
东芝 - TOSHIBA 晶体小信号双极晶体管开关光电二极管
页数 文件大小 规格书
5页 195K
描述
Silicon NPN Epitaxial Type

TTC007 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-G3针数:3
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.77Is Samacsys:N
最大集电极电流 (IC):1 A集电极-发射极最大电压:50 V
配置:SINGLE最小直流电流增益 (hFE):200
JESD-30 代码:R-PDSO-G3元件数量:1
端子数量:3最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:NPN认证状态:Not Qualified
表面贴装:YES端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

TTC007 数据手册

 浏览型号TTC007的Datasheet PDF文件第2页浏览型号TTC007的Datasheet PDF文件第3页浏览型号TTC007的Datasheet PDF文件第4页浏览型号TTC007的Datasheet PDF文件第5页 
TTC007  
TOSHIBA Transistor Silicon NPN Epitaxial Type  
TTC007  
Unit: mm  
High-Speed Switching Applications  
DC-DC Converter Applications  
High DC current gain: hFE = 400 to1000 (IC = 0.1 A)  
Low collector-emitter saturation voltage: VCE(sat) = 0.12 V (max)  
High-speed switching : tf = 85 ns (typ.)  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Collector-base voltage  
Symbol  
Rating  
Unit  
V
CBO  
V
CEO  
V
EBO  
100  
V
V
V
Collector-emitter voltage  
Emitter-base voltage  
50  
7
1. BASE  
DC  
I
1
2
C
2. EMITTER  
Collector current  
A
A
Pulse  
I
CP  
3. COLLECTOR  
Base current  
I
0.1  
B
JEDEC  
JEITA  
t = 10 s  
DC  
P
1.1  
C
Collector power dissipation  
W
(Note 1)  
0.7  
TOSHIBA  
2-3S1C  
Junction temperature  
T
150  
°C  
°C  
j
Weight: 0.01 g (typ.)  
Storage temperature range  
T
55 to 150  
stg  
Note1: Mounted on FR4 board (glass epoxy; 645 mm2,1.6 mm thick; Cu area: 645 mm2)  
Note2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly  
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute  
maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
1
2010-02-08  

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