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SSESD11B PDF预览

SSESD11B

更新时间: 2024-09-17 01:21:11
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 86K
描述
Transient Voltage Suppressors

SSESD11B 数据手册

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SSESD11B  
Transient Voltage  
Suppressors  
Micro−Packaged Diodes for ESD Protection  
The ESD11B Series is designed to protect voltage sensitive  
components from ESD. Excellent clamping capability, low leakage,  
and fast response time provide best in class protection on designs that  
are exposed to ESD. Because of its small size, it is suited for use in  
cellular phones, MP3 players, digital cameras and many other portable  
applications where board space comes at a premium.  
www.onsemi.com  
Specification Features  
Low Capacitance 12 pF  
MARKING  
DIAGRAM  
Low Clamping Voltage  
Small Body Outline Dimensions: 0.60 mm x 0.30 mm  
Low Body Height: 0.3 mm  
Stand−off Voltage: 5.0 V  
DSN2  
CASE 152AS  
A
Low Leakage  
Response Time is < 1 ns  
A = Specific Device Code  
IEC61000−4−2 Level 4 ESD Protection  
IEC61000−4−4 Level 4 EFT Protection  
ORDERING INFORMATION  
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
Device  
SSESD11B5.0ST5G  
Package  
Shipping  
DSN2  
(Pb−Free)  
5000 / Tape &  
Reel  
Mechanical Characteristics  
MOUNTING POSITION: Any  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
QUALIFIED MAX REFLOW TEMPERATURE: 260°C  
Device Meets MSL 3 Requirements  
MAXIMUM RATINGS  
Rating  
IEC 61000−4−2 (ESD)  
Symbol  
Value  
Unit  
Contact  
Air  
15  
15  
kV  
Total Power Dissipation on FR−5 Board  
°P °  
250  
mW  
D
(Note 1) @ T = 25°C  
A
Thermal Resistance, Junction−to−Ambient  
R
400  
−40 to +125  
260  
°C/W  
°C  
q
JA  
Junction and Storage Temperature Range T , T  
J
stg  
Lead Solder Temperature − Maximum  
(10 Second Duration)  
T
L
°C  
Peak Pulse Current, 8 x 20 ms double  
I
pp  
2.0  
A
exponential waveform (Figure 5)  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. FR−5 = 1.0 x 0.75 x 0.62 in.  
See Application Note AND8308/D for further description of survivability specs.  
© Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
September, 2015 − Rev. 1  
SSESD11B/D  
 

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