Datasheet > SSESD11B5.0ST5G

SSESD11B5.0ST5G

更新时间： 2024-11-07 01:21:11

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
6页	86K
描述
Transient Voltage Suppressors

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中文翻译

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数据手册

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SSESD11B5.0ST5G 数据手册

SSESD11B

Transient Voltage

Suppressors

Micro−Packaged Diodes for ESD Protection

The ESD11B Series is designed to protect voltage sensitive

components from ESD. Excellent clamping capability, low leakage,

and fast response time provide best in class protection on designs that

are exposed to ESD. Because of its small size, it is suited for use in

cellular phones, MP3 players, digital cameras and many other portable

applications where board space comes at a premium.

www.onsemi.com

Specification Features

• Low Capacitance 12 pF

MARKING

DIAGRAM

• Low Clamping Voltage

• Small Body Outline Dimensions: 0.60 mm x 0.30 mm

• Low Body Height: 0.3 mm

• Stand−off Voltage: 5.0 V

DSN2

CASE 152AS

• Low Leakage

• Response Time is < 1 ns

A = Specific Device Code

• IEC61000−4−2 Level 4 ESD Protection

• IEC61000−4−4 Level 4 EFT Protection

ORDERING INFORMATION

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

†

Compliant

Device

SSESD11B5.0ST5G

Package

Shipping

DSN2

(Pb−Free)

5000 / Tape &

Reel

Mechanical Characteristics

MOUNTING POSITION: Any

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

QUALIFIED MAX REFLOW TEMPERATURE: 260°C

Device Meets MSL 3 Requirements

MAXIMUM RATINGS

Rating

IEC 61000−4−2 (ESD)

Symbol

Value

Unit

Contact

Air

Total Power Dissipation on FR−5 Board

°P °

250

(Note 1) @ T = 25°C

Thermal Resistance, Junction−to−Ambient

400

−40 to +125

260

°C/W

°C

Junction and Storage Temperature Range T , T

stg

Lead Solder Temperature − Maximum

(10 Second Duration)

°C

Peak Pulse Current, 8 x 20 ms double

2.0

exponential waveform (Figure 5)

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

1. FR−5 = 1.0 x 0.75 x 0.62 in.

See Application Note AND8308/D for further description of survivability specs.

Publication Order Number:

September, 2015 − Rev. 1

SSESD11B/D

12 3 4 5 6

中文翻译

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