SN74AUC2G240
DUAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES534B–DECEMBER 2003–REVISED SEPTEMBER 2006
FEATURES
•
Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
•
•
±8-mA Output Drive at 1.8 V
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
•
Optimized for 1.8-V Operation and Is 3.6-V I/O
Tolerant to Support Mixed-Mode Signal
Operation
•
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
•
Ioff Supports Partial-Power-Down Mode
Operation
– 1000-V Charged-Device Model (C101)
•
•
•
Sub-1-V Operable
Max tpd of 1.8 ns at 1.8 V
Low Power Consumption, 10 µA at 1.8 V
DCT PACKAGE
(TOP VIEW)
DCU PACKAGE
(TOP VIEW)
YEP OR YZP PACKAGE
(BOTTOM VIEW)
4 5
GND
2Y
2A
VCC
1
2
3
4
8
7
6
5
1OE
VCC
2OE
1Y
1
2
3
4
8
7
6
5
1OE
1A
3 6
2 7
1 8
1Y
1A
2Y
2OE
1Y
1A
2OE
VCC
1OE
2A
GND
2Y
GND
2A
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This dual buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC
operation.
The SN74AUC2G240 is designed specifically to improve the performance and density of 3-state memory
address drivers, clock drivers, and bus-oriented receivers and transmitters.
This device is organized as two 1-bit buffers/drivers with separate output-enable (OE) inputs. When OE is low,
the device passes data from the A input to the Y output. When OE is high, the outputs are in the
high-impedance state.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.