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ꢊꢅꢄ ꢋ ꢇ ꢌꢍꢁ ꢎꢅꢏ ꢎꢐ ꢀꢍ ꢏ ꢍꢑꢒꢌ ꢐ ꢓ ꢈ ꢄꢏꢒ
SCES478A − AUGUST 2003 − REVISED NOVEMBER 2003
DCT OR DCU PACKAGE
(TOP VIEW)
D
D
Available in the Texas Instruments
NanoStar and NanoFree Packages
Optimized for 1.8-V Operation and Is 3.6-V
I/O Tolerant to Support Mixed-Mode Signal
Operation
1A
1B
V
CC
1
2
3
4
8
7
6
5
1Y
2B
2A
2Y
D
I
Supports Partial-Power-Down Mode
off
GND
Operation
D
D
D
D
D
Sub 1-V Operable
YEP OR YZP PACKAGE
(BOTTOM VIEW)
Max t of 1.5 ns at 1.8 V
pd
Low Power Consumption, 10 µA at 1.8 V
4 5
3 6
2 7
1 8
GND
2Y
1B
2A
2B
1Y
8-mA Output Drive at 1.8 V
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
1A
V
CC
D
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
description/ordering information
This dual 2-input positive-OR gate is operational at 0.8-V to 2.7-V V , but is designed specifically for 1.65-V
CC
to 1.95-V V
operation.
CC
The SN74AUC2G32 performs the Boolean function Y + A ) B or Y + A • B in positive logic.
NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This device is fully specified for partial-power-down applications using I . The I circuitry disables the outputs,
off
off
preventing damaging current backflow through the device when it is powered down.
For more information about AUC Little Logic devices, please refer to the TI application report, Applications of
Texas Instruments AUC Sub-1-V Little Logic Devices, literature number SCEA027.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
T
A
PACKAGE
‡
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
SN74AUC2G32YEPR
SN74AUC2G32YZPR
Tape and reel
_ _ _UG_
NanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
−40°C to 85°C
SSOP − DCT
Tape and reel
Tape and reel
SN74AUC2G32DCTR
SN74AUC2G32DCUR
U32_ _ _
U32_
VSSOP − DCU
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available
at www.ti.com/sc/package.
DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and
one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
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Copyright 2003, Texas Instruments Incorporated
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