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SN74AUC2G34DCKRG4 PDF预览

SN74AUC2G34DCKRG4

更新时间: 2024-11-16 11:51:07
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
15页 738K
描述
DUAL BUFFER GATE

SN74AUC2G34DCKRG4 数据手册

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SN74AUC2G34  
DUAL BUFFER GATE  
www.ti.com  
SCES514BNOVEMBER 2003REVISED JANUARY 2007  
FEATURES  
Available in the Texas Instruments  
NanoFree™ Package  
Low Power Consumption, 10 µA at 1.8 V  
±8-mA Output Drive at 1.8 V  
Optimized for 1.8-V Operation and Is 3.6-V I/O  
Tolerant to Support Mixed-Mode Signal  
Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
Ioff Supports Partial-Power-Down Mode  
Operation  
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
Sub-1-V Operable  
1000-V Charged-Device Model (C101)  
Max tpd of 1.6 ns at 1.8 V  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
DRL PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(BOTTOM VIEW)  
3
2
1
4
5
6
2Y  
VCC  
1Y  
2A  
GND  
1A  
1
2
3
6
5
4
1A  
GND  
2A  
1Y  
VCC  
2Y  
1
2
3
6
5
4
1A  
GND  
2A  
1Y  
VCC  
2Y  
1Y  
VCC  
2Y  
1
2
3
6
5
4
1A  
GND  
2A  
DESCRIPTION/ORDERING INFORMATION  
This dual buffer gate is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC  
operation.  
The SN74AUC2G34 performs the Boolean function Y = A in positive logic.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SOT-563 – DRL  
Reel of 3000  
SN74AUC2G34YZPR  
_ _ _U9_  
Reel of 4000  
Reel of 3000  
Reel of 3000  
SN74AUC2G34DRLR  
SN74AUC2G34DBVR  
SN74AUC2G34DCKR  
U9_  
–40°C to 85°C  
SOT-23 – DBV  
U34_  
U9_  
SC-70 – DCK  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2003–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

SN74AUC2G34DCKRG4 替代型号

型号 品牌 替代类型 描述 数据表
SN74AUC2G34DCKRE4 TI

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Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Opera
SN74AUC2G34DCKR TI

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Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Opera

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