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SN74AUC2G53YZTR PDF预览

SN74AUC2G53YZTR

更新时间: 2024-11-16 03:10:31
品牌 Logo 应用领域
德州仪器 - TI 解复用器开关复用器或开关信号电路光电二极管
页数 文件大小 规格书
20页 507K
描述
SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH OR 2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER

SN74AUC2G53YZTR 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Obsolete零件包装代码:BGA
包装说明:GREEN, DSBGA-8针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:1 week
风险等级:7.87Is Samacsys:N
其他特性:BUILT-IN SPDT SWITCH模拟集成电路 - 其他类型:SINGLE-ENDED MULTIPLEXER
JESD-30 代码:R-XBGA-B8JESD-609代码:e1
长度:1.9 mm湿度敏感等级:1
信道数量:2功能数量:1
端子数量:8标称断态隔离度:59 dB
通态电阻匹配规范:4 Ω最大通态电阻 (Ron):40 Ω
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装代码:VFBGA
封装等效代码:BGA8,2X4,20封装形状:RECTANGULAR
封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH峰值回流温度(摄氏度):260
电源:1.2/2.5 V认证状态:Not Qualified
座面最大高度:0.625 mm最大信号电流:0.1 A
子类别:Multiplexer or Switches最大供电电流 (Isup):0.01 mA
最大供电电压 (Vsup):2.7 V最小供电电压 (Vsup):0.8 V
标称供电电压 (Vsup):1.1 V表面贴装:YES
最长断开时间:4.2 ns最长接通时间:3.6 ns
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:0.5 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:0.9 mm
Base Number Matches:1

SN74AUC2G53YZTR 数据手册

 浏览型号SN74AUC2G53YZTR的Datasheet PDF文件第2页浏览型号SN74AUC2G53YZTR的Datasheet PDF文件第3页浏览型号SN74AUC2G53YZTR的Datasheet PDF文件第4页浏览型号SN74AUC2G53YZTR的Datasheet PDF文件第5页浏览型号SN74AUC2G53YZTR的Datasheet PDF文件第6页浏览型号SN74AUC2G53YZTR的Datasheet PDF文件第7页 
SN74AUC2G53  
SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH OR  
2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER  
www.ti.com  
SCES484BAUGUST 2003REVISED JANUARY 2007  
FEATURES  
DCT OR DCU PACKAGE  
Available in the Texas Instruments  
(TOP VIEW)  
NanoFree™ Package  
COM  
INH  
GND  
GND  
V
CC  
1
2
3
4
8
7
6
5
Operates at 0.8 V to 2.7 V  
Sub-1-V Operable  
Y1  
Y2  
A
Low Power Consumption, 10 µA at 2.7 V  
High On-Off Output Voltage Ratio  
High Degree of Linearity  
YZP PACKAGE  
(BOTTOM VIEW)  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
4
3
2
1
5
6
7
8
GND  
GND  
INH  
A
ESD Protection Exceeds JESD 22  
Y2  
Y1  
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
COM  
V
CC  
1000-V Charged-Device Model (C101)  
DESCRIPTION/ORDERING INFORMATION  
This analog switch is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.1-V to 2.7-V VCC  
operation.  
The SN74AUC2G53 can handle both analog and digital signals. The device permits signals with amplitudes of  
up to VCC (peak) to be transmitted in either direction.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for  
analog-to-digital and digital-to-analog conversion systems.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SSOP – DCT  
Reel of 3000  
SN74AUC2G53YZPR  
_ _ _U4_  
–40°C to  
85°C  
Reel of 3000  
Reel of 3000  
SN74AUC2G53DCTR  
SN74AUC2G53DCUR  
U53_ _ _  
U53_  
VSSOP – DCU  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).  
FUNCTION TABLE  
CONTROL  
INPUTS  
ON  
CHANNEL  
INH  
L
A
L
Y1  
Y2  
L
H
X
H
None  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2003–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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