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SN74AUC2G53

更新时间： 2024-09-27 22:11:51
品牌 Logo 应用领域
德州仪器 - TI 解复用器开关光电二极管
页数 文件大小 规格书
18页 329K
描述
SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH OR 2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER

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SN74AUC2G53 数据手册

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SN74AUC2G53  
SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH OR  
2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER  
www.ti.com  
SCES484A–AUGUST 2003–REVISED MARCH 2005  
FEATURES  
DCT OR DCU PACKAGE  
(TOP VIEW)  
•
Available in the Texas Instruments  
NanoStar™ and NanoFree™ Packages  
COM  
INH  
GND  
GND  
V
CC  
1
2
3
4
8
7
6
5
•
•
•
•
•
•
Operates at 0.8 V to 2.7 V  
Y1  
Y2  
A
Sub-1-V Operable  
Low Power Consumption, 10 µA at 2.7 V  
High On-Off Output Voltage Ratio  
High Degree of Linearity  
YEP OR YZP PACKAGE  
(BOTTOM VIEW)  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
4
3
2
1
5
6
7
8
GND  
GND  
INH  
A
•
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
Y2  
Y1  
COM  
V
CC  
– 1000-V Charged-Device Model (C101)  
DESCRIPTION/ORDERING INFORMATION  
This analog switch is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.1-V to 2.7-V VCC  
operation.  
The SN74AUC2G53 can handle both analog and digital signals. The device permits signals with amplitudes of up  
to VCC (peak) to be transmitted in either direction.  
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for  
analog-to-digital and digital-to-analog conversion systems.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)  
NanoStar™ – WCSP (DSBGA)  
0.23-mm Large Bump – YEP  
SN74AUC2G53YEPR  
_ _ _U4_  
Tape and reel  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SN74AUC2G53YZPR  
–40°C to 85°C  
SSOP – DCT  
Tape and reel  
Tape and reel  
SN74AUC2G53DCTR  
SN74AUC2G53DCUR  
U53_ _ _  
U53_  
VSSOP – DCU  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).  
FUNCTION TABLE  
CONTROL  
INPUTS  
ON  
CHANNEL  
INH  
L
A
L
Y1  
Y2  
L
H
X
H
None  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar, NanoFree are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2003–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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