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SN74AUC2G66 PDF预览

SN74AUC2G66

更新时间: 2024-09-27 22:11:51
品牌 Logo 应用领域
德州仪器 - TI 开关
页数 文件大小 规格书
16页 322K
描述
DUAL BILATERAL ANALOG SWITCH

SN74AUC2G66 数据手册

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ꢀꢁꢂ ꢃ ꢄ ꢅꢆ ꢇꢈ ꢉ ꢉ  
ꢊꢅꢄ ꢋ ꢌꢍ ꢋꢄꢎ ꢏꢐꢄꢋ ꢄꢁꢄ ꢋꢑ ꢈ ꢀ ꢒꢍ ꢎꢆ ꢓ  
SCES507 − NOVEMBER 2003  
DCT OR DCU PACKAGE  
(TOP VIEW)  
D
Available in the Texas Instruments  
NanoStarand NanoFreePackages  
D
D
D
D
D
D
D
Operates at 0.8 V to 2.7 V  
Sub 1-V Operable  
1A  
1B  
2C  
V
CC  
1
2
3
4
8
7
6
5
1C  
2B  
2A  
Max t of 0.5 ns at 1.8 V  
pd  
GND  
Low Power Consumption, 10 µA at 2.7 V  
High On-Off Output Voltage Ratio  
High Degree of Linearity  
YEP OR YZP PACKAGE  
(BOTTOM VIEW)  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
4 5  
3 6  
2 7  
1 8  
GND  
2C  
1B  
2A  
2B  
1C  
D
ESD Performance Tested Per JESD 22  
− 2000-V Human-Body Model  
(A114-B, Class II)  
− 200-V Machine Model (A115-A)  
− 1000-V Charged-Device Model (C101)  
1A  
V
CC  
description/ordering information  
This dual analog switch is operational at 0.8-V to 2.7-V V , but is designed specifically for 1.1-V to 2.7-V V  
CC  
operation.  
CC  
The SN74AUC2G66 can handle both analog and digital signals. It permits signals with amplitudes of up to 2.7-V  
(peak) to be transmitted in either direction.  
NanoStarand NanoFreepackage technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for  
analog-to-digital and digital-to-analog conversion systems.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
T
A
PACKAGE  
NanoStar− WCSP (DSBGA)  
0.23-mm Large Bump − YEP  
Tape and reel SN74AUC2G66YEPR  
Tape and reel SN74AUC2G66YZPR  
_ _ _U6_  
NanoFree− WCSP (DSBGA)  
0.23-mm Large Bump − YZP (Pb-free)  
−40°C to 85°C  
SSOP − DCT  
Tape and reel  
Tape and reel  
SN74AUC2G66DCTR  
SN74AUC2G66DCUR  
U66_ _ _  
U66_  
VSSOP − DCU  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one  
following character to designate the assembly/test site. Pin  
1 identifier indicates solder-bump composition  
(1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
ꢎꢠ  
Copyright 2003, Texas Instruments Incorporated  
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1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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