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SN74AUC2G66_08 PDF预览

SN74AUC2G66_08

更新时间: 2024-11-16 05:17:39
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德州仪器 - TI 开关
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18页 460K
描述
DUAL BILATERAL ANALOG SWITCH

SN74AUC2G66_08 数据手册

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SN74AUC2G66  
DUAL BILATERAL ANALOG SWITCH  
www.ti.com  
SCES507ANOVEMBER 2003REVISED JANUARY 2007  
FEATURES  
DCT OR DCU PACKAGE  
(TOP VIEW)  
Available in the Texas Instruments  
NanoFree™ Package  
1A  
1B  
2C  
V
CC  
1
2
3
4
8
7
6
5
Operates at 0.8 V to 2.7 V  
Sub-1-V Operable  
1C  
2B  
2A  
Max tpd of 0.5 ns at 1.8 V  
GND  
Low Power Consumption, 10 µA at 2.7 V  
High On-Off Output Voltage Ratio  
High Degree of Linearity  
YZP PACKAGE  
(BOTTOM VIEW)  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
4
3
2
1
5
6
7
8
GND  
2C  
2A  
2B  
1C  
V
ESD Performance Tested Per JESD 22  
1B  
1A  
2000-V Human-Body Model  
(A114-B, Class II)  
CC  
200-V Machine Model (A115-A)  
1000-V Charged-Device Model (C101)  
DESCRIPTION/ORDERING INFORMATION  
This dual analog switch is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.1-V to 2.7-V VCC  
operation.  
The SN74AUC2G66 can handle both analog and digital signals. It permits signals with amplitudes of up to 2.7-V  
(peak) to be transmitted in either direction.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for  
analog-to-digital and digital-to-analog conversion systems.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SSOP – DCT  
Reel of 3000  
SN74AUC2G66YZPR  
_ _ _U6_  
–40°C to 85°C  
Reel of 3000  
Reel of 3000  
SN74AUC2G66DCTR  
SN74AUC2G66DCUR  
U66_ _ _  
U66_  
VSSOP – DCU  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).  
FUNCTION TABLE  
CONTROL  
INPUT  
(C)  
SWITCH  
L
OFF  
ON  
H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2003–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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