SN74AUC2G66
DUAL BILATERAL ANALOG SWITCH
www.ti.com
SCES507A–NOVEMBER 2003–REVISED JANUARY 2007
FEATURES
DCT OR DCU PACKAGE
(TOP VIEW)
•
Available in the Texas Instruments
NanoFree™ Package
1A
1B
2C
V
CC
1
2
3
4
8
7
6
5
•
•
•
•
•
•
•
Operates at 0.8 V to 2.7 V
Sub-1-V Operable
1C
2B
2A
Max tpd of 0.5 ns at 1.8 V
GND
Low Power Consumption, 10 µA at 2.7 V
High On-Off Output Voltage Ratio
High Degree of Linearity
YZP PACKAGE
(BOTTOM VIEW)
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
4
3
2
1
5
6
7
8
GND
2C
2A
2B
1C
V
•
ESD Performance Tested Per JESD 22
1B
1A
–
2000-V Human-Body Model
(A114-B, Class II)
CC
–
–
200-V Machine Model (A115-A)
1000-V Charged-Device Model (C101)
DESCRIPTION/ORDERING INFORMATION
This dual analog switch is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.1-V to 2.7-V VCC
operation.
The SN74AUC2G66 can handle both analog and digital signals. It permits signals with amplitudes of up to 2.7-V
(peak) to be transmitted in either direction.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for
analog-to-digital and digital-to-analog conversion systems.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SSOP – DCT
Reel of 3000
SN74AUC2G66YZPR
_ _ _U6_
–40°C to 85°C
Reel of 3000
Reel of 3000
SN74AUC2G66DCTR
SN74AUC2G66DCUR
U66_ _ _
U66_
VSSOP – DCU
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
CONTROL
INPUT
(C)
SWITCH
L
OFF
ON
H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.