SN74AUC2G79
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
www.ti.com
SCES536A–DECEMBER 2003–REVISED MARCH 2005
FEATURES
DCT OR DCU PACKAGE
(TOP VIEW)
•
Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
1CLK
1D
2Q
GND
V
CC
1
2
3
4
8
7
6
5
•
Optimized for 1.8-V Operation and Is 3.6-V I/O
Tolerant to Support Mixed-Mode Signal
Operation
1Q
2D
2CLK
•
Ioff Supports Partial-Power-Down Mode
Operation
•
•
•
•
•
Sub-1-V Operable
YEP OR YZP PACKAGE
(BOTTOM VIEW)
Max tpd of 1.9 ns at 1.8 V
Low Power Consumption, 10-µA Max ICC
±8-mA Output Drive at 1.8 V
4
3
2
1
5
6
7
8
GND
2Q
2CLK
2D
1D
1CLK
1Q
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
V
CC
•
ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DESCRIPTION/ORDERING INFORMATION
This single positive-edge-triggered D-type flip-flop is operational at 0.8-V to 2.7-V VCC, but is designed
specifically for 1.65-V to 1.95-V VCC operation.
When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the
positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the
rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting
the levels at the outputs.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
Tape and reel
Tape and reel
SN74AUC2G79YEPR
_ _ _UR_
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SN74AUC2G79YZPR
–40°C to 85°C
SSOP – DCT
Tape and reel
Tape and reel
SN74AUC2G79DCTR
SN74AUC2G79DCUR
U79_ _ _
U79_
VSSOP – DCU
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.